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Intel® 3100 Chipset on 90nm Process Technology: Product Brief

Product Overview
The Intel® 3100 chipset combines server-class memory and I/O controller functions into a single component, creating the first integrated Intel® chipset specifically optimized for embedded, communications, and storage applications. When combined with Pentium® or Celeron® mobile processors on 90nm process technology, the Intel 3100 chipset addresses developers’ needs for high-performance, high-reliability, low-power platforms within small form-factors such as PrAMC, CompactPCI*, and COM Express*.

PCI Express* serial I/O technology and DDR2 memory technology increase I/O bandwidth and reduce system latency for data-intensive applications. The 400 to 667 MHz front-side bus provides support for Pentium and Celeron mobile processors, as well as an upgrade path to future use with next-generation Intel® dual-core processors. The Intel 3100 chipset includes a four-channel Enhanced Direct Memory Access controller, providing low-latency and high throughput data transfer capability with no CPU intervention for higher overall system performance. It also integrates I/O controller features such as Serial ATA*, PCI and USB, saving board real-estate and power by removing the need for a separate, legacy I/O bridge chip.

Along with a strong ecosystem of hardware and software vendors, including members of the Intel® Communications Alliance, Intel helps cost-effectively meet development challenges and speed time-to-market.

Read the full Intel® 3100 Chipset on 90nm Process Technology Product Brief.

Intel® 3100 Chipset on 90nm Process Technology: Product Brief

Product Overview
The Intel® 3100 chipset combines server-class memory and I/O controller functions into a single component, creating the first integrated Intel® chipset specifically optimized for embedded, communications, and storage applications. When combined with Pentium® or Celeron® mobile processors on 90nm process technology, the Intel 3100 chipset addresses developers’ needs for high-performance, high-reliability, low-power platforms within small form-factors such as PrAMC, CompactPCI*, and COM Express*.

PCI Express* serial I/O technology and DDR2 memory technology increase I/O bandwidth and reduce system latency for data-intensive applications. The 400 to 667 MHz front-side bus provides support for Pentium and Celeron mobile processors, as well as an upgrade path to future use with next-generation Intel® dual-core processors. The Intel 3100 chipset includes a four-channel Enhanced Direct Memory Access controller, providing low-latency and high throughput data transfer capability with no CPU intervention for higher overall system performance. It also integrates I/O controller features such as Serial ATA*, PCI and USB, saving board real-estate and power by removing the need for a separate, legacy I/O bridge chip.

Along with a strong ecosystem of hardware and software vendors, including members of the Intel® Communications Alliance, Intel helps cost-effectively meet development challenges and speed time-to-market.

Read the full Intel® 3100 Chipset on 90nm Process Technology Product Brief.

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