The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links.
We are sorry, This PDF is available in download format only
Intel® 3100 Chipset for Intel® Xeon® and Celeron® Processor: BriefProduct OverviewThe Intel® 3100 chipset combines server-class memory and I/O controller functions into a single component, creating the first integrated Intel® chipset specifically optimized for embedded, communications, and storage applications. This single-chip system controller replaces a separate memory controller hub and I/O controller hub, significantly conserving board real estate and power consumption.The 667 MHz front-side bus (FSB) supports Intel® Xeon® processors LV and ULV and the Celeron® processors 1.66 GHz and 1.83 GHz addressing the needs of high-performance, low-power platforms within small form factor designs such as PrAMC, Compact PCI* and COM Express.* The Intel Xeon processor LV has a thermal design power (TDP) of 31W; the ULV version has a TDP of 15W; and the Celeron processor has a TDP of 27W.Intel Xeon processors LV and ULV combine the benefits of dual-core processing capability and intelligent power management for improved performance/watt, while the Celeron processors provide value in a single-core solution. These processors support FSB parity and Intel® Virtualization Technology, making them ideal for a wide range of high-performance applications with restricted power requirements.Along with a strong ecosystem of hardware and software vendors, including members of the Intel® Communications Alliance, Intel helps cost-effectively meet development challenges and speed time-to-market.Read the full Intel® 3100 Chipset for Intel® Xeon® and Celeron® Processor Product Brief.
AOpen’s solutions, powered by 4th gen Intel® Core™ processors, deliver responsive content.
Discusses virtualization advances in hardware, technology, and platform consolidation.
Explains virtualization fundamentals, business impact, industry factors, model comparisons, and more.
Explores Intel® Virtualization Technology, how it works, and common virtualization techniques.
Demonstrates attachment of strain gauges to measure manufacturing board flexure. (v.1, Jan. 2011)