Intel® Xeon® Processor C5500/C3500 Series: Thermal Guide
This document provides guidelines for the design of thermal and mechanical solutions for processors in the Picket Post platform. The components described in this document include:
•The processor thermal solution (heatsink) and associated retention hardware.
•The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate.
Read the full Intel® Xeon® Processor C5500/C3500 Series Thermal/ Mechanical Design Guide.
Presents research on multi-core processor performance optimization under thermal constraints.
Virtualization enables workload consolidation on a single architecture, simplifying network complexity.
Explores Intel® Virtualization Technology, how it works, and common virtualization techniques.
Processor array reduces image resolution time for radar analytics. (v.1, Feb. 2011)
Explains virtualization fundamentals, business impact, industry factors, model comparisons, and more.
Learn how intelligent digital advances and signage solutions enhance shopper experience.