The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links.
We are sorry, This PDF is available in download format only
Intel® Xeon® Processor C5500/C3500 Series: Thermal GuideIntroduction This document provides guidelines for the design of thermal and mechanical solutions for processors in the Picket Post platform. The components described in this document include:•The processor thermal solution (heatsink) and associated retention hardware.•The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate.Read the full Intel® Xeon® Processor C5500/C3500 Series Thermal/ Mechanical Design Guide.
Intel® Xeon® processors provide power savings, scalability performance, integration, and more.
Discusses Intel® Atom™ LEAP* architecture and embedded systems instructions for energy efficiency.
Presents research on multi-core processor performance optimization under thermal constraints.
Demo runs two OSs with Intel® architecture and virtualization for wireless medical use case.
Telecommunications computing architecture for industrial and military use. (v.1, Feb. 2011)
Processor array reduces image resolution time for radar analytics. (v.1, Feb. 2011)