Intel® Xeon® Processor C5500/C3500 Series: Thermal Guide
This document provides guidelines for the design of thermal and mechanical solutions for processors in the Picket Post platform. The components described in this document include:
•The processor thermal solution (heatsink) and associated retention hardware.
•The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate.
Read the full Intel® Xeon® Processor C5500/C3500 Series Thermal/ Mechanical Design Guide.
Presents research on multi-core processor performance optimization under thermal constraints.
Presents research on multi-core processor performance optimization under thermal constraints. (Apr. 2010)
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