G/Q family of Intel® Express Chipsets: Thermal Design Guide
The document describes thermal design guidelines for using embedded Intel® G45, G41, Q45, Q35 and Q965 Express Chipsets in 1U and PICMG 1.3 form factors. The objective of designing the thermal solution is to maintain the case temperature of chipsets below the maximum allowable case temperature as specified in datasheet.
G/Q family of Intel® Express Chipsets Thermal Design Guide.
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