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2nd Gen Intel® Core™ Processor Family: Thermal Design GuideThe power needs of electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over the product’s life cycle, the heat generated by the device must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.The goals of this document are to:• Specify the thermal and mechanical specification for the device.• Describe a reference thermal solution that meets the specifications.Read the full 2nd Gen Intel® Core™ Processor Family Thermal Design Guide.
Discusses increasing throughput for multi-core processors. (v.1, June 2009)
Measure actual power consumption of components and embedded systems. (v.001, July 2011)