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Intel® Communications Chipset 89xx Series: Design GuideIntroductionPower dissipation requirements for electronic components have risen with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.The goals of this document are to:• Describe the thermal and mechanical specifications for the Intel® Communications Chipset 89xx Series.• Describe reference solutions that meet the thermal and mechanical specifications of the Intel® Communications Chipset 89xx Series.Read the full Intel® Communications Chipset 89xx Series Design Guide.
Overview includes performance, processor, thermal, and system states. (v.001, Aug. 2011)
Discusses increasing throughput for multi-core processors. (v.1, June 2009)
Measure actual power consumption of components and embedded systems. (v.001, July 2011)