Intel® Processor-based Communications Platform: Diagram
This block diagram provides a description of the functions, capabilities, and connectivity within the Intel® platform shown. Based on Intel® microarchitecture (formerly Ivy Bridge) and manufactured on 22-nanometer process technology, these processors are designed for single-socket systems with options for two and four cores and a thermal design power (TDP) range of 15 watts to 40 watts. When paired with the Intel® Communications Chipset 89xx Series, this platform extends the scalability of Intel® architecture into smaller footprint communications applications and intelligent systems without sacrificing standard industry features such as workload acceleration, multi-core processing, and virtualization.
INTERACTIVE BLOCK DIAGRAM
Mouse over Intel® components to learn more.
Intel® Embedded Design Center (Intel® EDC) support
Access technical and sales assistance, register for an Intel® EDC account, or manage your account.Contact us >
Processor and chipset selection, peripheral devices, board size, power budget, and thermal analysis.
Design Review Services
Submit your designs, and we will analyze them for compliance with guidelines and report potential issues within one week.
The Intel® Design-In Tools Store allows you to speed through motherboard and system design with validation tools and services available for purchase from Intel.
Test Tool Loan Program
Some design-in debug and validation tools are available at no cost to embedded and IoT developers who meet the loan program criteria.