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Intel® 82575EB: Thermal Design Considerations Specification

This document describes the thermal characteristics for the 82575EB. Use this document to properly design a thermal solution for systems implementing the device.

Properly designed solutions provide adequate cooling to maintain the case temperature (Tcase) at or below those listed. Ideally, this is accomplished by providing a low local ambient temperature and creating a minimal thermal resistance to that local ambient temperature. Heat sinks may be required if case temperatures exceed those listed. Any attempt to operate outside of these operating limits may result in improper functionality or permanent damage to the Intel component and potentially other components within the system. Maintaining the proper thermal environment is essential to reliable, long-term component/system operation.

Measuring the Thermal Conditions

This document provides a method for determining the operating temperature of the device in a specific system based on case temperature. Case temperature is a function of the local ambient and internal temperatures of the component. This document specifies a maximum allowable Tcase for the device.

Read the full Intel® 82575EB Thermal Design Considerations Specification.

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