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Intel® 82571EB/82572EI Thermal Design Considerations

This document describes the thermal characteristics for Intel® 82571EB and 82572EI. Use this document to properly design a thermal solution for systems implementing the 82571EB and 82572EI.

Properly designed solutions provide adequate cooling to maintain the 82571EB or 82572EI case temperature (Tcase) at or below those listed in Table 2. Ideally, this is accomplished by providing a low local ambient temperature and creating a minimal thermal resistance to that local ambient temperature. Heat sinks may be required if case temperatures exceed those listed in Table 2. Any attempt to operate the 82571EB or 82572EI outside of these operating limits may result in improper functionality or permanent damage to the Intel component and potentially other components within the system. Maintaining the proper thermal environment is essential to reliable, long-term component/system operation.

Intended Audience

The intended audience for this document is System Design Engineers using the 82571EB or 82572EI. System designers are required to address component and system-level thermal challenges as the market continues to adopt products with higher-speeds and port densities. New designs may be required to provide better cooling solutions for silicon devices depending on the type of system and target operating environment.

Measuring the Thermal Conditions

This document provides a method for determining the operating temperature of the 82571EB or 82572EI in a specific system based on case temperature. Case temperature is a function of the local ambient and internal temperatures of the component. This document specifies a maximum allowable Tcase for the 82571EB and 82572EI.

Read the full Intel® 82571EB/82572EI Thermal Design Considerations.

Intel® 82571EB/82572EI Thermal Design Considerations

This document describes the thermal characteristics for Intel® 82571EB and 82572EI. Use this document to properly design a thermal solution for systems implementing the 82571EB and 82572EI.

Properly designed solutions provide adequate cooling to maintain the 82571EB or 82572EI case temperature (Tcase) at or below those listed in Table 2. Ideally, this is accomplished by providing a low local ambient temperature and creating a minimal thermal resistance to that local ambient temperature. Heat sinks may be required if case temperatures exceed those listed in Table 2. Any attempt to operate the 82571EB or 82572EI outside of these operating limits may result in improper functionality or permanent damage to the Intel component and potentially other components within the system. Maintaining the proper thermal environment is essential to reliable, long-term component/system operation.

Intended Audience

The intended audience for this document is System Design Engineers using the 82571EB or 82572EI. System designers are required to address component and system-level thermal challenges as the market continues to adopt products with higher-speeds and port densities. New designs may be required to provide better cooling solutions for silicon devices depending on the type of system and target operating environment.

Measuring the Thermal Conditions

This document provides a method for determining the operating temperature of the 82571EB or 82572EI in a specific system based on case temperature. Case temperature is a function of the local ambient and internal temperatures of the component. This document specifies a maximum allowable Tcase for the 82571EB and 82572EI.

Read the full Intel® 82571EB/82572EI Thermal Design Considerations.

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