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82562EZ/82551ER/82541ER Combined Footprint LOM Design Guide Application Note 456

Intel® 82562EZ(EX)/82551ER(IT), 82541ER Combined Footprint LOM (AP-456)

Introduction

The Intel® 82541ER Gigabit Ethernet Controller and the Intel® 82551ER(IT)/82562EZ(EX) Fast Ethernet Controllers are all manufactured in a footprint-compatible 15 mm x 15 mm, 196-ball grid array package. Many of the critical signal pin locations on the 82541ER are identical to signals on the 82562EZ(EX) and 82551ER(IT) allowing designers to create a single design that accommodates these three parts. Because the usage of some pins on the 82541ER differ from the usage on the 82551ER(IT) and the 82562EZ(EX), the three parts are not referred to as "pin compatible." The term "footprint compatible" refers to the fact that the parts share the same package size, number and pattern of pins, and layout of signals that allow for the flexible, cost-effective, multipurpose design. Therefore, it is easy to populate a single board design with any of the three parts to maximize value while matching your customers' performance needs.

Scope

This application note identifies the design differences between the 82541ER, 82551ER(IT), and 82562EZ(EX). The table in Section 8.0 lists the stuffing (population) options for the three parts.

For other necessary design collateral, please refer to the "Reference Documents" section.

Read the full Intel® 82562EZ(EX)/82551ER(IT), 82541ER Combined Footprint LOM

Intel® 82562EZ(EX)/82551ER(IT), 82541ER Combined Footprint LOM (AP-456)

Introduction

The Intel® 82541ER Gigabit Ethernet Controller and the Intel® 82551ER(IT)/82562EZ(EX) Fast Ethernet Controllers are all manufactured in a footprint-compatible 15 mm x 15 mm, 196-ball grid array package. Many of the critical signal pin locations on the 82541ER are identical to signals on the 82562EZ(EX) and 82551ER(IT) allowing designers to create a single design that accommodates these three parts. Because the usage of some pins on the 82541ER differ from the usage on the 82551ER(IT) and the 82562EZ(EX), the three parts are not referred to as "pin compatible." The term "footprint compatible" refers to the fact that the parts share the same package size, number and pattern of pins, and layout of signals that allow for the flexible, cost-effective, multipurpose design. Therefore, it is easy to populate a single board design with any of the three parts to maximize value while matching your customers' performance needs.

Scope

This application note identifies the design differences between the 82541ER, 82551ER(IT), and 82562EZ(EX). The table in Section 8.0 lists the stuffing (population) options for the three parts.

For other necessary design collateral, please refer to the "Reference Documents" section.

Read the full Intel® 82562EZ(EX)/82551ER(IT), 82541ER Combined Footprint LOM

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