We are sorry, This PDF is available in download format only

Intel® Communications Chipset 89xx Series: Design Guide

Power dissipation requirements for electronic components have risen with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.

Intel® Embedded Design Center


Find in-depth documentation, tools, and resources for embedded and IoT developers.

Start designing

Contact Intel


Access technical and sales assistance, register for an Intel® Embedded Design Center account, or manage your account.

Contact us

Related Videos