• <More on Intel.com

Intel® Socket Test Technology Application Note

We are sorry, This PDF is available in download format only

Intel® Socket Test Technology Application Note

The Intel® Socket Test Technology for the LGA775 socket is a test chip that enables testing for the mechanical integrity and electrical continuity of both socket-to-board solder ball connectivity and socket-to-processor contact connectivity. Once inserted into the board’s LGA775 socket, the test chip works with either in-circuit testers (ICT) or manufacturing defect analyzers (MDA) that have access to all the socket nets through test fixture probes.

An ICT uses digital test vectors which execute very quickly when power is applied to the board—typically less than a few milliseconds depending upon test head capability. An MDA doesn’t power the board, but uses its analog measurement capability. Test time using an MDA is typically longer.

The test chip with product code JM8HKZLVA was developed to support the Intel® 91X/925/925XE Express chipset based products. Refer to the Intel® Socket Test Technology for the LGA775 Socket — Product Code JM8HKZLVA document for further information.

The test chip with part number JM8YKZLVA described in this document supports the Intel® 955X, 945, 946, and 965 Express chipset based products, and is not compatible for testing Intel 91X/925/925E Express chipset-based products.

Read the full Intel® Socket Test Technology Application Note.