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Motherboard Repair: Ball Grid Array Socket Rework [83 K]
Demos replacing damaged socket components for motherboard repair with thermal profile development, board cleaning, and new component preparation.

Demos replacing damaged socket components for motherboard repair with thermal profile development, board cleaning, and new component preparation.

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Surface Mount Board Assembly Soldering: Guide
Guide: Explains the surface mount technology board assembly process for soldering components to boards and replacing existing components.

Guide: Explains the surface mount technology board assembly process for soldering components to boards and replacing existing components.

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Electrostatic Discharge and Electrical Overstress: Guide
Document describes how electrostatic discharge and electrical overstress are caused, the damage they cause, and methods of prevention.

Document describes how electrostatic discharge and electrical overstress are caused, the damage they cause, and methods of prevention.

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Shipping, Transport Media, and Moisture Sensitivity Level: Guide
The document outlines proper shipping and handling of semiconductors using packaging that accounts for moisture sensitivity and transportation stress.

The document outlines proper shipping and handling of semiconductors using packaging that accounts for moisture sensitivity and transportation stress.

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Additional Resources—Intel® Learning Network: Guide
This guide provides directions on how to access information on the Intel® Learning Network, such as Manufacturing Advantage Service documents.

This guide provides directions on how to access information on the Intel® Learning Network, such as Manufacturing Advantage Service documents.

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Customer Information Service Portal Links to Helpful Web Sites [68 K]
Access information about Intel® technologies from the Customer Information Service Portal, with various web links.

Access information about Intel® technologies from the Customer Information Service Portal, with various web links.

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Electrostatic Discharge Detection: Antenna and Oscilloscope [85 K]
Demos antenna and oscilloscope use for electrostatic discharge detection, including the minimum tool requirements and how to set up the parameters.

Demos antenna and oscilloscope use for electrostatic discharge detection, including the minimum tool requirements and how to set up the parameters.

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Copy Exactly! [66 K]
Copy Exactly! method matches manufacturing site to development site and is used by test facilities to deliver product from multiple production sites.

Copy Exactly! method matches manufacturing site to development site and is used by test facilities to deliver product from multiple production sites.

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Intel Executive Perspectives on Quality and Reliability [68 K]
Chief Executive Officer Paul Otellini and Director of the Corporate Quality Network Nasser Bozorg-Grayeli talk about their view of quality.

Chief Executive Officer Paul Otellini and Director of the Corporate Quality Network Nasser Bozorg-Grayeli talk about their view of quality.

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Intel® LGA115X Socket: Board Factory Mandarin [84 K]
Shows proper installation of the LGA115X socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.

Shows proper installation of the LGA115X socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.

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Intel® LGA115X Socket: System Factory Mandarin [83 K]
Shows processor insertion into LGA115X socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.

Shows processor insertion into LGA115X socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.

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Intel® LGA115X Socket: System Factory Portuguese Subtitles [84 K]
Shows processor insertion into LGA115X socket independent loading mechanism to minimize socket contact handling damage; Portuguese subtitles.

Shows processor insertion into LGA115X socket independent loading mechanism to minimize socket contact handling damage; Portuguese subtitles.

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Intel® LGA115X Socket: System Integration Factory Spanish [83 K]
Shows processor insertion into LGA115X socket independent loading mechanism to minimize socket contact handling damage; Spanish translation.

Shows processor insertion into LGA115X socket independent loading mechanism to minimize socket contact handling damage; Spanish translation.

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Intel® LGA13XX Socket: Board Factory Mandarin [83 K]
Shows proper installation of the LGA13XX socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.

Shows proper installation of the LGA13XX socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.

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Intel® LGA13XX Socket: System Factory Mandarin [84 K]
Shows processor insertion into LGA13XX socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.

Shows processor insertion into LGA13XX socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.

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Intel® LGA2011 Socket: Board Factory [84 K]
Shows proper installation of the Intel® LGA2011 Series socket independent loading mechanism to minimize handling damage to socket contacts.

Shows proper installation of the Intel® LGA2011 Series socket independent loading mechanism to minimize handling damage to socket contacts.

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Intel® LGA2011 Socket in System Factory: Mandarin [83 K]
Shows processor insertion into the LGA2011 socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.

Shows processor insertion into the LGA2011 socket independent loading mechanism to minimize socket contact handling damage; Mandarin translation.

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Land Grid Array Socket and Package Technology
Process for the handling, inspection, and integration of land grid array socket and package technology.

Process for the handling, inspection, and integration of land grid array socket and package technology.

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Intel® Manufacturing Enabling Guide [66 K]
Describes purpose of the Intel® Manufacturing Enabling Guide and provides links to chapters.

Describes purpose of the Intel® Manufacturing Enabling Guide and provides links to chapters.

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Measuring I/O Shield Alignment [83 K]
Instructions for properly aligning the Intel® motherboard and the I/O opening on a computer chassis to ensure proper fitting of the shield plate.

Instructions for properly aligning the Intel® motherboard and the I/O opening on a computer chassis to ensure proper fitting of the shield plate.

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Non-Destructive Testing [67 K]
Non-destructive techniques like X-ray, SAM, SQUID, TDR, and thermal imaging provide data without altering the electronic device; details provided.

Non-destructive techniques like X-ray, SAM, SQUID, TDR, and thermal imaging provide data without altering the electronic device; details provided.

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Ball Grid Array Rework: Package-on-Package Devices [83 K]
Package-on-package device rework demos developing a thermal reflow profile, PCB pad site dress and cleaning, and new component preparation.

Package-on-package device rework demos developing a thermal reflow profile, PCB pad site dress and cleaning, and new component preparation.

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Parametric Fault Isolation [69 K]
Parametric fault isolation analyzes electrical behavior of input/output circuitry using an SPA; includes graph.

Parametric fault isolation analyzes electrical behavior of input/output circuitry using an SPA; includes graph.

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Product Identification and Unit-Level Traceability [69 K]
Intel’s system to manage and store product ID with unit-level traceability for CPUs and chipsets, and lot-level traceability for boards and systems.

Intel’s system to manage and store product ID with unit-level traceability for CPUs and chipsets, and lot-level traceability for boards and systems.

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Product Functional Analysis Capabilities [70 K]
Intel’s quality management system uses seven capabilities in product functional analysis, providing timely root cause info; includes lab location map.

Intel’s quality management system uses seven capabilities in product functional analysis, providing timely root cause info; includes lab location map.

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