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Thermal Models: Download Icepak* and Flotherm* models to simulate and optimize solutions for mobile Intel® Core™2 Duo processors. (v.1, Dec. 2006)
Motherboard Mechanical Layout Tool provides relative mechanical shock risk information regarding chipset or platform controller hub placement.
Application Note: Provides mechanical design guidance to improve shock performance and prevent failure in dynamic events. (v.001.6, July 2012)
Application Note: Enables proper design of thermal solutions for the IXP42X product line, ensuring adequate cooling. (v.1, Nov. 2005)
Application Note: Provides guidance for customizing RedBoot* to load and execute images with the IXP42X product line. (v.2, Sept. 2004)
Application Note: Describes PCI 16-bit memory read implementations for the IXP42X product line, including pin logic and drawings. (v.2, Sept. 2004)
Update: Overview of the Intel® Management Engine on Montevina platform and comparison with Santa Rosa platform, including tool changes. (v.1.2)
Guide: Describes the Intel® Management Engine BIOS Extension configuration procedure for Montevina platform with Intel® AMT 4.0. (v.1.01, May 2008)
Checklist: Hardware and embedded controller firmware requirements and known problems to support Montevina with Intel® AMT 4.0. (v.1, Dec. 2007)
Presentation: Intel® Management Engine Ignition Firmware manufacturing on Crystal Forest server and Gladden platforms. (v.000.5, Nov. 2011)
Specification Update: Intel® Communications Chipset 89xx errata, spec changes and clarifications, and documentation changes. (v.001.1, Oct. 2012)
Addendum: Supplements external design specification for the Intel® 5100 Memory Controller Hub Chipset with AC information. (July 2008)
Design Spec: Revises product information and design guidelines for the Intel® 5100 Memory Controller Hub Chipset. (July 2009)
Files: Provides RAS tool support files, test spec, users guide, read me, and setup files.
Specification: Electrical, mechanical, and thermal specifications for the Intel® Xeon® processor 5300 series, including signal quality. (July 2007)
Specs: Explains signal, controller, interface, thermal, and power specifications for the Mobile Intel® 4 Series Express Chipset family. (Sept. 2009)
Recommendations: Uses the Montevina platform with Intel® Management Engine to consider the impact on manufacturing flow. (v.0.8, April 2008)
Schematics: Customer Reference Board annotations and board information for the Intel® Centrino®2 Processor Platform Small Form Factor. (Jan. 2009)