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Thermal Models: Download Icepak* and Flotherm* models to simulate and optimize solutions for mobile Intel® Core™2 Duo processors. (v.1, Dec. 2006)
Hardware Design Guide: Recommendations for developing with the IXP45X/IXP46X product lines, including information on interfaces. (v.4, Feb. 2007)
Motherboard Mechanical Layout Tool provides relative mechanical shock risk information regarding chipset or platform controller hub placement.
All Things are Connected Because of Me - Vantron Technology * IOT Gateway based on Intel® Intelligent Systems Framework
Application Note: Provides mechanical design guidance to improve shock performance and prevent failure in dynamic events. (v.001.6, July 2012)
Platform Design Guide: Design guidelines for Crystal Forest Gladden components, including layout, routing, and power information. (v.1.8, May 2012)
Application Brief: The IXP42X product line with Ethernet POWERLINK* software enables clear communication within the factory. (v.1, June 2005)
Application Note: Enables proper design of thermal solutions for the IXP42X product line, ensuring adequate cooling. (v.1, Nov. 2005)
Application Note: Provides guidance for customizing RedBoot* to load and execute images with the IXP42X product line. (v.2, Sept. 2004)
Application Note: Describes PCI 16-bit memory read implementations for the IXP42X product line, including pin logic and drawings. (v.2, Sept. 2004)
Update: Overview of the Intel® Management Engine on Montevina platform and comparison with Santa Rosa platform, including tool changes. (v.1.2)
Guide: Describes the Intel® Management Engine BIOS Extension configuration procedure for Montevina platform with Intel® AMT 4.0. (v.1.01, May 2008)
Checklist: Hardware and embedded controller firmware requirements and known problems to support Montevina with Intel® AMT 4.0. (v.1, Dec. 2007)
Presentation: Intel® Management Engine Ignition Firmware manufacturing on Crystal Forest server and Gladden platforms. (v.000.5, Nov. 2011)
Specification Update: Intel® Communications Chipset 89xx errata, spec changes and clarifications, and documentation changes. (v.001.1, Oct. 2012)
Addendum: Supplements external design specification for the Intel® 5100 Memory Controller Hub Chipset with AC information. (July 2008)
Design Spec: Revises product information and design guidelines for the Intel® 5100 Memory Controller Hub Chipset. (July 2009)
Files: Provides RAS tool support files, test spec, users guide, read me, and setup files.
Specification: Electrical, mechanical, and thermal specifications for the Intel® Xeon® processor 5300 series, including signal quality. (July 2007)
Specs: Explains signal, controller, interface, thermal, and power specifications for the Mobile Intel® 4 Series Express Chipset family. (Sept. 2009)
Recommendations: Uses the Montevina platform with Intel® Management Engine to consider the impact on manufacturing flow. (v.0.8, April 2008)
Schematics: Customer Reference Board annotations and board information for the Intel® Centrino®2 Processor Platform Small Form Factor. (Jan. 2009)