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Presentation: SiO2 scaling, high-k/metal-gate problems, breakthroughs, and performance reports for NMOS and PMOS transistors.
Presentation Discusses Role of High-K Gate Dielectrics and Metal Gate Electrodes in Emerging Nanoelectronic Devices.
Presentation: 40nm gate length InSb P-channel strained QWFET for low-power logic apps, including advantages, materials, and benchmarking.
Paper covers optimization for a 32nm SoC platform with 2nd Generation high-k/Metal gate transistors.
Presentation examines the impacts and benefits of RF CMOS technology scaling in high-k/Metal gate era for RF SoC (System-on-Chip) applications.
RF CMOS technology benefits from general CMOS technology scaling and improves by innovative transistor and interconnect technologies.
Gate Dielectric Scaling for High-Performance CMOS: SiO2 to High-K, an option for the 45nm high-performance logic technology node.
Demonstrates a Germanium p-channel QWFET with thin scaled TOXE and high mobility, delivering four times higher hole mobility.
Paper: n-type and p-type metal electrodes on high-K gate dielectrics enable same oxide thickness, desirable transistor threshold, and more.
Paper: composite high-K gate in the QWFET silicon substrate integration for thin electrical oxide, low gate leakage, and carrier confinement.
Paper: composite high-K gate in the QWFET silicon substrate integration for thin electrical oxide, low gate leakage, and carrier confinement.
Discusses low gate-leakage silicon and non-silicon transistor nanotechnology using high-κ gate dielectrics and metal gate electrodes.
Article, IEEE Election Device Letters, Vol 25, No. 6, June 2004: High-k/Metal-Gate Stack and Its MOSFET Characteristics.
Paper examines and evaluates logic performance of Schottky-gate QWFETs against that of advanced Strained Si MOSFETs in low power voltages.
Backgrounder: Intel's 22nm innovation ushers in new semiconductor technology and ensures the continuation of Moore's Law.
Provides basic information for the most common classes of EFI drivers. Includes design guidelines for PCI, USB, and SCSI buses.
Presentation: Tahir Ghani (Intel) reviews traditional‐scaling, modern innovations and future challenges and options for Nano‐CMOS Transistor Scaling.
Logic Paper: 32nm logic technology for high performance microprocessors
Presentation of 32nm logic technology for high performance microprocessors featuring 2nd generation high-k + metal gate transistors.
Presentation: low power optimization for a 32nm SoC platform with 2nd generation high-k/Metal gate transistors.
Presentation: low power optimization for a 32nm SoC platform with 2nd generation high-k/Metal gate transistors.
Brief examines the impacts and benefits of RF CMOS technology scaling in high-k/Metal gate era for RF SoC (System-on-Chip) applications.
Record NMOS and PMOS drive currents are reported, along with the tightest contacted gate pitch for a 32nm or 28nm technology.