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Intel® Itanium® Processor for Mission-Critical Servers
Technical Paper: Next generation Intel® Itanium® processor implemented in 32-nm CMOS has 3.1 billion transistors, and delivers increased performance.

Technical Paper: Next generation Intel® Itanium® processor implemented in 32-nm CMOS has 3.1 billion transistors, and delivers increased performance.

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Intel® E8870 Chipset [87 K]
Intel® E8870 Chipset, featuring the E8870SP component, allows for multi-node configurations of up to eight Intel® Itanium® processors.

Intel® E8870 Chipset, featuring the E8870SP component, allows for multi-node configurations of up to eight Intel® Itanium® processors.

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Intel® Itanium® Family Specifications [95 K]
Detailed specifications on each member of the Intel® Itanium® family.

Detailed specifications on each member of the Intel® Itanium® family.

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Intel® Itanium® Processors [82 K]
Intel® Itanium® processors deliver robust performance and support today's most demanding business applications.

Intel® Itanium® processors deliver robust performance and support today's most demanding business applications.

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Itanium® Processor 9500 Series Enhances Enterprise Performance
Brief: The Intel® Itanium® processor 9500 series features new microarchitecture to deliver superior performance, reliability, and power efficiency.

Brief: The Intel® Itanium® processor 9500 series features new microarchitecture to deliver superior performance, reliability, and power efficiency.

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Intel® Itanium® Processor 9300/9500 Series: Datasheet
Electrical, thermal, and mechanical specs, pin listing, system management bus, signal definitions for the Intel® Itanium® processor 9300/9500 series.

Electrical, thermal, and mechanical specs, pin listing, system management bus, signal definitions for the Intel® Itanium® processor 9300/9500 series.

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RAS Features of the Mission-Critical Converged Infrastructure
White paper covers new RAS features, server integrity, top RAS differentiators, and competitive comparisons.

White paper covers new RAS features, server integrity, top RAS differentiators, and competitive comparisons.

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HP, Intel Deliver Mission-Critical Converged Infrastructure [87 K]
Watch how HP and Intel work together to deliver on the promise of mission-critical converged infrastructure.

Watch how HP and Intel work together to deliver on the promise of mission-critical converged infrastructure.

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Intel® Itanium® Processor 9300 Series Enabling Component Suppliers
Supplier listing: Intel® Itanium® processor 9300 series enabling components.

Supplier listing: Intel® Itanium® processor 9300 series enabling components.

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Server Migration: Transition to Intel®-based Solutions [90 K]
Discover how to implement server migration from expensive, proprietary platforms to Intel® technology-based solutions for mission-critical needs.

Discover how to implement server migration from expensive, proprietary platforms to Intel® technology-based solutions for mission-critical needs.

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Solve Power and Cooling Challenges for Effective Computing
White Paper: Intel® Xeon® and Intel® Itanium® processor-based servers scale effective computing capabilities and lower power and cooling costs.

White Paper: Intel® Xeon® and Intel® Itanium® processor-based servers scale effective computing capabilities and lower power and cooling costs.

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Intel® Processor-based Server Platforms: Enhanced RAS Capabilities
White Paper: Enhanced reliability, availability, and serviceability (RAS) of Intel® processor-based server platforms simplify business solutions.

White Paper: Enhanced reliability, availability, and serviceability (RAS) of Intel® processor-based server platforms simplify business solutions.

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Intel® E8870 (870) Chipset Specification Update
Intel® E8870 (870) chipset device and documentation errata, specification clarifications, and changes.

Intel® E8870 (870) chipset device and documentation errata, specification clarifications, and changes.

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Intel® E8870 Chipset Support Components
Vendor List: support components for E8870 Chipset-based system designs.

Vendor List: support components for E8870 Chipset-based system designs.

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Intel® E8870 Chipset: Cost-Effectiveness for Scalable Servers
White Paper: Intel® E8870 Chipset has architecture for Intel Itanium® processor-based servers and allows systems to scale from 2-16 processors.

White Paper: Intel® E8870 Chipset has architecture for Intel Itanium® processor-based servers and allows systems to scale from 2-16 processors.

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EFI CPU I/O Protocol Specification v0.9
Covers core code and services required for an implementation of the CPU I/O Protocol of the Intel® Platform Innovation Framework for EFI.

Covers core code and services required for an implementation of the CPU I/O Protocol of the Intel® Platform Innovation Framework for EFI.

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EFI Cache Subclass Specification v0.9
Defines core code for an implementation of the cache data hub subclass of the Intel® Platform Innovation Framework for EFI.

Defines core code for an implementation of the cache data hub subclass of the Intel® Platform Innovation Framework for EFI.

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Intel® 7500 Scalable Memory Buffer Datasheet
Datasheet: Intel® 7500 Scalable Memory Buffer Datasheet.

Datasheet: Intel® 7500 Scalable Memory Buffer Datasheet.

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Pinned Packaging: Packaging Databook, Ch. 13
Packaging Databook, Ch. 13: Plastic Pin Grid Array Package technology, and its physical structure, electric modeling and performance.

Packaging Databook, Ch. 13: Plastic Pin Grid Array Package technology, and its physical structure, electric modeling and performance.

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International Packaging Specifications: Packaging Databook, Ch. 11
Packaging Databook, Ch. 11: international packing specifications with rules and standards.

Packaging Databook, Ch. 11: international packing specifications with rules and standards.

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Shipping and Transport Media: Packaging Databook, Ch. 10
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

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Leaded Surface Mount Technology: Intel's Packaging Databook, Ch. 7
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

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Intel® Itanium® Processor 9000 and 9100 Series Datasheet
Intel® Itanium® processor 9000 and 9100 series.

Intel® Itanium® processor 9000 and 9100 series.

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Tape Carrier Package: Databook, Chapter 12
Packaging Databook, Ch 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

Packaging Databook, Ch 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

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ESD/EOS: Intel's Packaging Databook Ch. 6
Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.

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