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Application Note: Clarify aspects of programming SPI flash on ICH family-based platforms, includes compatibility, BIOS, and tools.(v.2.4, Sept. 2008)
Files: Provides Cave Creek MUD DMI, PCIe*, SATA, HSPICE*, and more files with an associated model user’s guide. (v.001)
Files: Database, integration, library, and more files for the Stargo Reference Design. (v.001)
Files: Schematic design files for Crystal Forest Gladden (Stargo) includes adw, library, and ptf files. (v.002)
Bill of Materials: List of materials used on a CPIC platform with Cave Creek technology, including revision table of BOM changes.
User’s Guide: Icepak* thermal model for designers simulating, analyzing, and optimizing the Cave Creek Platform Controller Hub. (v.1.0, Jan. 2011)
Application Note: Provides mechanical design guidance to improve shock performance and prevent failure in dynamic events. (v.001.6, July 2012)
Specification Update: Intel® Communications Chipset 89xx errata, spec changes and clarifications, and documentation changes. (v.001.1, Oct. 2012)
Files: Contains Cave Creek BSDL files, reference design license agreement, read me, and JTAG boundary scan testability.
Specs: Explains signal, controller, interface, thermal, and power specifications for the Mobile Intel® 4 Series Express Chipset family. (Sept. 2009)
Download Instructions: Provides a link to the Intel® Communications Chipset 89xx series software package for Linux* with Getting Started Guide.
Schematics: Customer Reference Board annotations and board information for the Intel® Centrino®2 Processor Platform Small Form Factor. (Jan. 2009)
White Paper: Describes changes to the memory reference code needed to support the ECC feature on embedded Intel® Core™ processors. (v.001, March 2012)
Schematic: Drawings, revision list, and BOM for the Stargo customer reference board development kit. (v.4.1)
Trace Length Calculator: Assists in matching on the DDR3 interface for Intel® Communications Chipset 89xx Series platform. (v.1.81, Dec. 2012)
Update: Intel® Core™2 Processor QX9000/Q9000/Q8000 Series
Specification: Intel® Core™2 processor QX9000/Q9000/Q8000 series electrical, mechanical, thermal, and signal specs and features. (Jan. 2009)
Thermal Design Guide: Describes Intel® Core™2 Extreme and Intel® Core™2 Quad processor thermal and cooling solution, and characteristics. (Nov. 2007)
Presentation: Covers Montevina platform customer reference board, design guidelines, software, technologies, and more. (Oct. 2008)
Presentation: Covers Intel® Q45 Express Chipset-based McCreary platform, including overview, design considerations, power delivery, and collaterals.
Guide: Provides Intel® Centrino® 2 processor technology-based platform design recommendations, guidelines, and considerations. (July 2009)
Presentation: Describes features of the Crystal Forest platform, such as cache protection, processor comparisons, and memory controller.