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Intel® ICH Family SPI Flash Programming Guide: Application Note [68 K]
Application Note: Clarify aspects of programming SPI flash on ICH family-based platforms, includes compatibility, BIOS, and tools.(v.2.4, Sept. 2008)

Application Note: Clarify aspects of programming SPI flash on ICH family-based platforms, includes compatibility, BIOS, and tools.(v.2.4, Sept. 2008)

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Cave Creek MUD: Files [53 K]
Files: Provides Cave Creek MUD DMI, PCIe*, SATA, HSPICE*, and more files with an associated model user’s guide. (v.001)

Files: Provides Cave Creek MUD DMI, PCIe*, SATA, HSPICE*, and more files with an associated model user’s guide. (v.001)

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Stargo Reference Design: Files [76 K]
Files: Database, integration, library, and more files for the Stargo Reference Design. (v.001)

Files: Database, integration, library, and more files for the Stargo Reference Design. (v.001)

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Crystal Forest Gladden Schematic Design: Files [76 K]
Files: Schematic design files for Crystal Forest Gladden (Stargo) includes adw, library, and ptf files. (v.002)

Files: Schematic design files for Crystal Forest Gladden (Stargo) includes adw, library, and ptf files. (v.002)

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CPIC with Cave Creek Technology: Bill of Materials [54 K]
Bill of Materials: List of materials used on a CPIC platform with Cave Creek technology, including revision table of BOM changes.

Bill of Materials: List of materials used on a CPIC platform with Cave Creek technology, including revision table of BOM changes.

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Cave Creek PCH Icepak* Thermal Model and User’s Guide [60 K]
User’s Guide: Icepak* thermal model for designers simulating, analyzing, and optimizing the Cave Creek Platform Controller Hub. (v.1.0, Jan. 2011)

User’s Guide: Icepak* thermal model for designers simulating, analyzing, and optimizing the Cave Creek Platform Controller Hub. (v.1.0, Jan. 2011)

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System Mechanical Design Guidance for Dynamic Events: App Note [76 K]
Application Note: Provides mechanical design guidance to improve shock performance and prevent failure in dynamic events. (v.001.6, July 2012)

Application Note: Provides mechanical design guidance to improve shock performance and prevent failure in dynamic events. (v.001.6, July 2012)

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Crystal Forest Gladden: Platform Design Guide
Platform Design Guide: Design guidelines for Crystal Forest Gladden components, including layout, routing, and power information. (v.1.8, May 2012)

Platform Design Guide: Design guidelines for Crystal Forest Gladden components, including layout, routing, and power information. (v.1.8, May 2012)

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Intel® Communications Chipset 89xx Series: Spec Update
Specification Update: Intel® Communications Chipset 89xx errata, spec changes and clarifications, and documentation changes. (v.001.1, Oct. 2012)

Specification Update: Intel® Communications Chipset 89xx errata, spec changes and clarifications, and documentation changes. (v.001.1, Oct. 2012)

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Cave Creek: BSDL Files [53 K]
Files: Contains Cave Creek BSDL files, reference design license agreement, read me, and JTAG boundary scan testability.

Files: Contains Cave Creek BSDL files, reference design license agreement, read me, and JTAG boundary scan testability.

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Mobile Intel® 4 Series Express Chipset External Design Spec, Vol.1 [76 K]
Specs: Explains signal, controller, interface, thermal, and power specifications for the Mobile Intel® 4 Series Express Chipset family. (Sept. 2009)

Specs: Explains signal, controller, interface, thermal, and power specifications for the Mobile Intel® 4 Series Express Chipset family. (Sept. 2009)

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Intel® Communications Chipset 89xx Series Linux* Software Download
Download Instructions: Provides a link to the Intel® Communications Chipset 89xx series software package for Linux* with Getting Started Guide.

Download Instructions: Provides a link to the Intel® Communications Chipset 89xx series software package for Linux* with Getting Started Guide.

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Intel® Centrino®2 Processor Platform Form Factor CRB: Schematics [76 K]
Schematics: Customer Reference Board annotations and board information for the Intel® Centrino®2 Processor Platform Small Form Factor. (Jan. 2009)

Schematics: Customer Reference Board annotations and board information for the Intel® Centrino®2 Processor Platform Small Form Factor. (Jan. 2009)

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Modify Memory Reference Code to Support ECC [53 K]
White Paper: Describes changes to the memory reference code needed to support the ECC feature on embedded Intel® Core™ processors. (v.001, March 2012)

White Paper: Describes changes to the memory reference code needed to support the ECC feature on embedded Intel® Core™ processors. (v.001, March 2012)

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Stargo Customer Reference Board: Schematic [77 K]
Schematic: Drawings, revision list, and BOM for the Stargo customer reference board development kit. (v.4.1)

Schematic: Drawings, revision list, and BOM for the Stargo customer reference board development kit. (v.4.1)

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Intel® Communications Chipset 89xx Series Platform: Calculator [77 K]
Trace Length Calculator: Assists in matching on the DDR3 interface for Intel® Communications Chipset 89xx Series platform. (v.1.81, Dec. 2012)

Trace Length Calculator: Assists in matching on the DDR3 interface for Intel® Communications Chipset 89xx Series platform. (v.1.81, Dec. 2012)

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Intel® Core™2 Processor QX9000/Q9000/Q8000 Series: Spec Update [76 K]
Update: Intel® Core™2 Processor QX9000/Q9000/Q8000 Series

Update: Intel® Core™2 Processor QX9000/Q9000/Q8000 Series

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Intel® Core™2 Processor QX9000/Q9000/Q8000 Series: Specifications [57 K]
Specification: Intel® Core™2 processor QX9000/Q9000/Q8000 series electrical, mechanical, thermal, and signal specs and features. (Jan. 2009)

Specification: Intel® Core™2 processor QX9000/Q9000/Q8000 series electrical, mechanical, thermal, and signal specs and features. (Jan. 2009)

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Intel® Core™2 Extreme and Quad Processor: Thermal Guide [57 K]
Thermal Design Guide: Describes Intel® Core™2 Extreme and Intel® Core™2 Quad processor thermal and cooling solution, and characteristics. (Nov. 2007)

Thermal Design Guide: Describes Intel® Core™2 Extreme and Intel® Core™2 Quad processor thermal and cooling solution, and characteristics. (Nov. 2007)

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Montevina Platform for Embedded Markets: Design-In Presentation [54 K]
Presentation: Covers Montevina platform customer reference board, design guidelines, software, technologies, and more. (Oct. 2008)

Presentation: Covers Montevina platform customer reference board, design guidelines, software, technologies, and more. (Oct. 2008)

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Intel® Q45 Express Chipset-Based Platform: Design-In Presentation [76 K]
Presentation: Covers Intel® Q45 Express Chipset-based McCreary platform, including overview, design considerations, power delivery, and collaterals.

Presentation: Covers Intel® Q45 Express Chipset-based McCreary platform, including overview, design considerations, power delivery, and collaterals.

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Crystal Forest Gladden Platform: Presentation
Presentation: Overview of the Crystal Forest Gladden platform, including information on packet processing and form factor mapping. (v.1.3, Sept. 2012)

Presentation: Overview of the Crystal Forest Gladden platform, including information on packet processing and form factor mapping. (v.1.3, Sept. 2012)

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Cave Creek Plug-In Card: Schematic
Schematic: Drawings for the Cave Creek plug-in card to show proper placement, configurations, and connections. (v.1.2, Feb. 2012)

Schematic: Drawings for the Cave Creek plug-in card to show proper placement, configurations, and connections. (v.1.2, Feb. 2012)

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Intel® Centrino® 2 Processor Technology: Design Guide [77 K]
Guide: Provides Intel® Centrino® 2 processor technology-based platform design recommendations, guidelines, and considerations. (July 2009)

Guide: Provides Intel® Centrino® 2 processor technology-based platform design recommendations, guidelines, and considerations. (July 2009)

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Crystal Forest Platform Introduction: Presentation
Presentation: Describes features of the Crystal Forest platform, such as cache protection, processor comparisons, and memory controller.

Presentation: Describes features of the Crystal Forest platform, such as cache protection, processor comparisons, and memory controller.

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