The Intel® 845MP and Intel® 845MZ chipsets are designed, validated and optimized for the Mobile Intel® Pentium® 4 Processor - M. The Intel® 845MP Chipset supports external graphics and Intel® 845MZ Chipset is optimized for value systems.
These platforms deliver the benefits of Intel® quality, reliability and stability that businesses need to deploy mobile computers with maximum ROI and performance headroom for the future. The ICH3-M (82801 CAM I/O Controller Hub 3) makes a direct connection to 845MP/MZ for smoother and faster access to peripherals, providing more benefit for extended PC usage models. Additionally, the chipset uses Intel's advanced mBGA packaging and supports 6 USB ports.
|Features and benefits|
|400MHz System Bus||Delivers a high-bandwidth connection between the Mobile Intel® Pentium® 4 processor - M and the platform|
|Intel® I/O Hub architecture||Provides a high bandwidth (266MB/s) I/O pipe that delivers fast communications and reduces latency time for I/O operations.|
|DDR 200/266 MHz SDRAM||Choice of memory technology to support a full range of price/performance requirements up to 1GB. DDR memory offers high reliability and consumes minimal power, critical to the mobile PC platform|
|AGP4X interface||Enables over 1 GB/s of graphics bandwidth interface for high-quality 2D, 3D, and video streams|
|Enhanced Intel Speedstep® Technology||Real-time dynamic switching of voltage and frequency between maximum performance and battery-optimized operation, based on CPU demand, for longer battery life|
|Deeper Sleep Alert State||Dynamic power management mode operates at 66% lower voltage than Deep sleep mode for longer battery life|
|Advanced Power Management||Supports ACPI 2.0 compliant for the latest power management and legacy power management with APM 1.2 compliant.|
|Ultra ATA/100||Takes advantage of industry innovations in HDD features and performance|
|Latest AC97 Controller||Excellent audio quality, with up to six channels for full surround sound capability including a simultaneous modem connection|
|Thin & Small Package Technology||Intel® 845MP/MZ chipset uses Intel's Flip-Chip Ball Grid Array (FCBGA) packaging that is excellent for reducing package size and improves the chipset cooling capability.|