Intel E8500/E8501 Chipset North Bridge and eXternal Memory Bridge
Intel® E8500/E8501 Chipset North Bridge (NB) and eXternal Memory Bridge (XMB) Thermal/Mechanical Design Guide, May 2006
As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® E8500/E8501 chipset North Bridge (NB) component and the Intel® E8500/E8501 chipset eXternal Memory Bridge (XMB) component.
• Describe two reference thermal solutions that meet the specification of the E8500/E8501 chipset NB component.
• Describe a reference thermal solution that meets the specification of the E8500/E8501 chipset XMB component.
Properly designed thermal solutions provide adequate cooling to maintain the E8500/E8501 chipset die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local ambient thermal resistance. By maintaining the E8500/E8501 chipset die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.
Read the full Chipset and Memory Bridge Design Guide.