Intel E7500/E7505 Chipset: Thermal/Mechanical Design Guide
Intel® E7500/E7505 Chipset Memory Controller Hub (MCH) Thermal and Mechanical Design Guidelines
As the complexity of computer systems increase, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.
The goals of this document are:
• To specify the operating limits of the Intel® E7500/E7505 chipset MCH components.
• To describe a reference thermal solution that meets the thermal specifications of the Intel® E7500/E7505 chipset MCH components.
Properly designed solutions provide adequate cooling to maintain the E7500/E7505 chipset MCH die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local ambient thermal resistance. By maintaining the E7500/E7505 chipset MCH die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.
The simplest and most cost-effective method is to improve the inherent system cooling characteristics through careful design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the E7500/E7505 chipset MCH components only.
Read the full Intel® E7500/E7505 Chipset Thermal Design Guide.