Intel® 855GM/855GME Chipset Platform
This design guide provides Intel’s design recommendations for the Intel® 855GM/855GME chipset-based systems. The guidelines have been developed to ensure maximum flexibility for board designers while reducing the risk of board-related issues.
Platform Component Features
The technologies represented by the Intel® Centrino® brand will include the Intel® Pentium® M processor, related chipsets, and 802.11 (Wi-Fi) wireless networking capability. The Intel Pentium M processor is a higher-performance, lower-power mobile processor with several micro-architectural enhancements over existing Intel mobile processors. Key features include: Dynamic Execution; data pre-fetch logic; 400-MHz, source-synchronous PSB; on-die, 1-MB second level cache with Advanced Transfer Cache Architecture; Streaming SIMD Extensions 2 (SSE2); and Enhanced Intel SpeedStep® Technology.
Intel Centrino mobile technology also includes the 855GM chipset components: the GMCH and the Intel® I/O Controller Hub 4-M (Intel® ICH4-M). The accelerated hub architecture interface (the chipset component interconnect) is designed into the chipset to provide an efficient, high bandwidth communication channel between the GMCH and the ICH4-M.
The GMCH component contains a PSB controller, a graphics controller, and a memory controller, while providing an LVDS interface and two Digital Video Out ports. The ICH4-M component integrates USB host controllers (supporting the USB 1.1 and USB 2.0 specification), an Ultra ATA 100/66/33 controller, a LAN controller, and an AC’97 digital controller, while providing interfaces for PCI and LPC devices, as well as FWH Flash BIOS.
Read the full Intel® 855GM/855GME Chipset Platform Guide.