Intel® 845 Chipset Used with SDR: Thermal Guide
Intel® 845 Chipset Thermal and Mechanical Design Guidelines for SDR Design Guide, January 2002
The objective of thermal management is to ensure that the temperature of all components in a system is maintained within functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements. Operation outside the functional limit can degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component. The goal of this document is to provide an understanding of the operating limits of the Intel® 845 chipset for use with Single Data Rate (SDR) memory devices and discuss a generic thermal solution.
Read the full Intel® 845 Chipset Used with SDR Thermal Guide.