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Intel® 7500 Chipset Thermal Mechanical Design Guidelines

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Intel® 7500 Chipset Thermal Mechanical Design Guidelines

Intel® 7500 Chipset: Thermal/Mechanical Design Guidelines, March 2010

The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® 7500 chipset.
• Describe reference thermal solutions that meet the specifications of the Intel 7500 chipset.

Properly designed thermal solutions provide adequate cooling to maintain the Intel 7500 chipset case temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the Intel 7500 chipset case temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the IOH. Operation outside the functional limits can cause data corruption or permanent damage to the component.

The simplest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the Intel 7500 chipset component only. For thermal design information on other chipset components, refer to the respective component TMDG.

Unless otherwise specified, the term “IOH” refers to the Intel® 7500 chipset.

Read the full Intel® 7500 Chipset Thermal Mechanical Design Guidelines.