Intel® 7300 Chipset Memory Controller Hub: Thermal Guide
As the complexity of computer systems increases, so do the power dissipation requirements. Care must
be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive
heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® 7300 Chipset Memory
Controller Hub (MCH).
• Describe a reference thermal solution that meets the specifications of the Intel® 7300 Chipset Memory Controller Hub (MCH).
Properly
designed thermal solutions provide adequate cooling to maintain the Intel® 7300 Chipset Memory Controller Hub (MCH) die temperatures at or below thermal
specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient
thermal resistance. By maintaining the Intel® 7300 Chipset Memory Controller Hub (MCH) die temperature at or below the specified limits, a system designer can
ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause
permanent changes in the operating characteristics of the component.
The simplest and most cost-effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic
noise.
This document addresses thermal design and specifications for the Intel® 7300 Chipset Memory Controller Hub (MCH) components only. For thermal design
information on other chipset components, refer to the respective component datasheet. For the PXH, refer to the Intel® 6700PXH 64-bit PCI Hub/6702PXH 64-bit PCI
Hub (PXH/PXH-V) Thermal/Mechanical Design Guidelines. For the Intel® 631xESB/632xESB I/O Controller Hub, refer to the Intel® 631xESB/632xESB I/O Controller Hub
Thermal/Mechanical Design Guidelines.
Read the full Intel® 7300
Chipset Memory Controller Hub Thermal Guide.
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Intel® 7300 Chipset Memory Controller Hub: Thermal Guide
As the complexity of computer systems increases, so do the power dissipation requirements. Care must
be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive
heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® 7300 Chipset Memory
Controller Hub (MCH).
• Describe a reference thermal solution that meets the specifications of the Intel® 7300 Chipset Memory Controller Hub (MCH).
Properly
designed thermal solutions provide adequate cooling to maintain the Intel® 7300 Chipset Memory Controller Hub (MCH) die temperatures at or below thermal
specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient
thermal resistance. By maintaining the Intel® 7300 Chipset Memory Controller Hub (MCH) die temperature at or below the specified limits, a system designer can
ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause
permanent changes in the operating characteristics of the component.
The simplest and most cost-effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic
noise.
This document addresses thermal design and specifications for the Intel® 7300 Chipset Memory Controller Hub (MCH) components only. For thermal design
information on other chipset components, refer to the respective component datasheet. For the PXH, refer to the Intel® 6700PXH 64-bit PCI Hub/6702PXH 64-bit PCI
Hub (PXH/PXH-V) Thermal/Mechanical Design Guidelines. For the Intel® 631xESB/632xESB I/O Controller Hub, refer to the Intel® 631xESB/632xESB I/O Controller Hub
Thermal/Mechanical Design Guidelines.
Read the full Intel® 7300
Chipset Memory Controller Hub Thermal Guide.
