Intel® 5000P/5000V/5000Z Chipsets MCH: Datasheet
The Intel® 5000P chipset is designed for systems based on the Dual-Core Intel® Xeon® 5000 sequence and supports a front side bus frequency up to 1333 module target specs. The Intel 5000P chipset contains two main components: Memory Controller Hub (MCH) for the host bridge and the I/O controller hub for the I/O subsystem. The Intel 5000P chipset uses the Intel® 631xESB/632xESB I/O Controller Hub.
The Intel® 5000 Series chipsets are implemented in a 0.13 um silicon process and packaged in a 1432 pin FCBGA package with pins on 1.092 mm (37mil) centers. The overall package dimensions are 42.5 mm by 42.5 mm.
The Intel 5000 Series chipset platform supports the Dual-Core Intel® Xeon® 5000 series (1066 MHz with 2 MB L2 cache on 65nm process in a 771-land, FC-LGA4 (Flip Chip Land Grid Array 4) package or the Dual-Core Intel® Xeon® 5100 series (1333 MHz with 4 MB shared L2 cache) on 65 nm process in a 771-land, FC-LGA4 (Flip Chip Land Grid Array 4) package. This package uses the matching LGA771 socket. The surface mount, LGA771 socket supports Direct Socket Loading (DSL). The Dual-Core Intel Xeon 5000 sequence (1066/1333 MHz) returns a processor signature of 0F5xh where x is the stepping number when the CPUID instruction is executed with EAX=1.
Note: Unless otherwise specified, the term processor in this document refers to the Dual-Core Intel Xeon 5000 sequence processors at both 1066MHz with 2 MB L2 cache and 1333 MHz with 4MB shared L2 cache on 65nm process in the 771-pin FC-LGA4 package.
Read the full Intel® 5000P/5000V/5000Z Chipsets MCH Datasheet.