The browser version you are using is not recommended for this site.Please consider upgrading to the latest version of your browser by clicking one of the following links.
We are sorry, This PDF is available in download format only
Intel® 5000 Series Chipset Memory Controller Hub: Thermal GuideIntroductionAs the complexity of computer systems increases, so do the power
dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include
selective use of ducting, and/or passive heatsinks.The goals of this document are to:• Outline the thermal and mechanical operating limits and
specifications for the Intel® 5000 Series chipset memory controller hub (MCH).• Describe reference thermal solutions that meet the specification of the Intel
5000 Series chipset MCH.Properly designed thermal solutions provide adequate cooling to maintain the Intel 5000 Series chipset MCH die temperatures at or
below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to
local-ambient thermal resistance. By maintaining the Intel 5000 Series chipset MCH die temperature at or below the specified limits, a system designer can ensure
the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause
permanent changes in the operating characteristics of the component.The simplest and most cost effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic
noise.his document addresses thermal design and specifications for the Intel 5000 Series chipset MCH components only. For thermal design information on other
chipset components, refer to the respective component datasheet. For the PXH, refer to the Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines. For
the Intel® 631xESB/632xESB I/O Controller Hub, refer to the Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design Guidelines.Read the full
Intel® 5000 Series Chipset Memory Controller Hub Thermal Guide.
Oracle, Intel deliver flexible virtualization across Oracle VM*, Jrockit* using Intel® Xeon® processor 5500 series.
Webcast: Intel and Gartner talked converged cloud.
Improve data availability on Swift* storage through parity, reducing cost and storage requirements.
Wake Forest uses Intel® architecture to save on hardware acquisition costs and increase IT agility.
Using Intel® Node Manager on Intel® Xeon® processor 5500 series platforms.
Demos the energy-efficient performance benefits of Intel® Intelligent Power Node Manager.