Intel® 4 Series Chipset: Thermal/Mechanical Design Guide
As the complexity of computer systems increases, so do power dissipation requirements. The additional power of next generation systems must be properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or passive heatsinks.
The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements. Operation outside the functional limit can degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component.
This document is for the following devices:
• Intel® P45 Chipset MCH (82P45 MCH)
• Intel® P43 Chipset MCH (82P43 MCH)
• Intel® G45 Chipset GMCH (82G45 GMCH)
• Intel® G43 Chipset GMCH (82G43 GMCH)
• Intel® G41 Chipset GMCH (82G41 GMCH)
• Intel® Q45 Chipset GMCH (82Q45 GMCH)
• Intel® Q43 Chipset GMCH (82Q43 GMCH).
This document presents the conditions and requirements to properly design a cooling solution for systems that implement the (G)MCH. Properly designed solutions provide adequate cooling to maintain the (G)MCH case temperature at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the (G)MCH case temperature at or below those recommended in this document, a system designer can ensure the proper functionality, performance, and reliability of this component.
Read the full Intel® 4 Series Chipset Thermal Guide.