Intel® 3200 and 3210 Chipset Memory Controller Hub: Thermal Guide
As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for Intel® 3210 and 3200 Chipsets.
• Describe a reference thermal solution that meets the specification of Intel® 3210 and 3200 Chipsets.
Properly designed thermal solutions provide adequate cooling to maintain Intel® 3210 and 3200 Chipsets die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining Intel® 3210 and 3200 Chipsets die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.
The simplest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for Intel® 3210 and 3200 Chipsets components only. For thermal design information on other chipset components, refer to the respective component datasheet. For the Intel® ICH9, refer to the Intel® I/O Controller Hub9 (ICH9) Thermal Design Guidelines.
Read the full Intel® 3200 and 3210 Chipset Memory Controller Hub Thermal Guide.