Explore Intel Fellow Mark Bohr's presentation from Intel Developer Forum 2014, with details and benefits of the new 14 nm transistor process and how the tri-gate fins are now taller, thinner, and closer together, enabling more performance, less active power, and longer battery life for greater computing experiences.
Intel's Babak Sabi shares how Embedded Multi-die Interconnect Bridge provides solutions for high-speed chip communication.
See how the new transistor process and tri-gate fin design enable greater computing experiences.
Shares how Compass* and Intel® Rack Scale Architecture support dynamic, software based infrastructure.
See how Intel® Rack Scale Architecture manages storage servers and deploys storage pooling software.
Walks through Intel® Node Manager setup and configuration, installation, and energy monitoring.
Minimize concerns of cost, effort, and complexity. (v.1, Oct. 2011)