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Intel® Itanium® Processor 9000 Sequence [84 K]
Itanium®-based servers deliver powerful and scalable performance for UNIX and mainframe environments.

Itanium®-based servers deliver powerful and scalable performance for UNIX and mainframe environments.

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Server Processor Comparison and Selection Guide
Intel® processor comparison guide helps select from a range of server platforms based on proven, efficient technology to meet your enterprise needs.

Intel® processor comparison guide helps select from a range of server platforms based on proven, efficient technology to meet your enterprise needs.

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Intel® E8870 (870) Chipset Specification Update
Intel® E8870 (870) chipset device and documentation errata, specification clarifications, and changes.

Intel® E8870 (870) chipset device and documentation errata, specification clarifications, and changes.

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Intel® 7500 Scalable Memory Buffer Datasheet
Datasheet: Intel® 7500 Scalable Memory Buffer Datasheet.

Datasheet: Intel® 7500 Scalable Memory Buffer Datasheet.

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Intel's Packaging Databook Chapter 8: Moisture Sensitivity/Desiccant Packaging/PSMCs Handling
Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.

Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.

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High-flying Application Performance on Intel® Itanium® Processors
Case Study: Sky Italia cuts software processing time and power consumption migrating to Itanium® processor-based HP Superdome2* servers for lower TCO.

Case Study: Sky Italia cuts software processing time and power consumption migrating to Itanium® processor-based HP Superdome2* servers for lower TCO.

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Intel® Itanium® Processor 9500 Series: Reference Manual [66 K]
Software development and optimization guide for the Intel® Itanium® processor 9500 series with microarchitectural description and performance info.

Software development and optimization guide for the Intel® Itanium® processor 9500 series with microarchitectural description and performance info.

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Dual-Core Intel® Itanium® 2 Processor: Reference Manual Update
Reference manual for the Dual-Core Intel® Itanium® 2 processor on software development and optimization.

Reference manual for the Dual-Core Intel® Itanium® 2 processor on software development and optimization.

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Intel® Itanium® Architecture Software Developer's Manual Volume 4
Manual: Intel® Itanium® Architecture Software Developer's Manual, Vol. 4: IA-32 Instruction Set.

Manual: Intel® Itanium® Architecture Software Developer's Manual, Vol. 4: IA-32 Instruction Set.

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Itanium® Software Conventions and Runtime Architecture Guide
Architecture Guide: Intel® Itanium® software conventions and runtime. Does not define operating-system interfaces.

Architecture Guide: Intel® Itanium® software conventions and runtime. Does not define operating-system interfaces.

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Intel® Itanium® Processor: Specification Update
Intel® Itanium® processor provides device and documentation errata, specification clarifications, and changes.

Intel® Itanium® processor provides device and documentation errata, specification clarifications, and changes.

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Intel's Packaging Databook Chapter 1: Introduction
Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.

Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.

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Intel's Packaging Databook Chapter 3: Alumina and Leaded Molded Technology: Packaging
Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

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Intel's Packaging Databook Chapter 4: IC Packages Performance Characteristics: Packaging
Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.

Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.

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Intel's Packaging Databook Chapter 7: Leaded Surface Mount Technology (SMT)
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

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Intel's Packaging Databook Chapter 12: Tape Carrier Package
Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

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Intel's Packaging Databook Chapter 13: Pinned Packaging
Packaging Databook, Ch. 13: Plastic Pin Grid Array Package technology, and its physical structure, electric modeling and performance.

Packaging Databook, Ch. 13: Plastic Pin Grid Array Package technology, and its physical structure, electric modeling and performance.

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Intel's Packaging Databook Chapter 15: The Chip Scale Package (CSP)
Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.

Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.

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Intel Processor-based Server Platforms: Enhanced RAS Capabilities
White Paper: Enhanced reliability, availability, and serviceability (RAS) of Intel® processor-based server platforms simplify business solutions.

White Paper: Enhanced reliability, availability, and serviceability (RAS) of Intel® processor-based server platforms simplify business solutions.

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EFI Pre-EFI Initialization Core Interface Specification v0.9
Defines core code for an implementation of the Pre-EFI Initialization phase of the Intel® Platform Innovation Framework for EFI.

Defines core code for an implementation of the Pre-EFI Initialization phase of the Intel® Platform Innovation Framework for EFI.

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EFI Pre-EFI Initialization Core Interface Specification v0.9
Defines the required core code and services for the Pre-EFI Initialization (PEI) phase of the Intel® Platform Innovation Framework for EFI.

Defines the required core code and services for the Pre-EFI Initialization (PEI) phase of the Intel® Platform Innovation Framework for EFI.

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Intel® Itanium® Processor 9300/9500 Series: Datasheet
Electrical, thermal, and mechanical specs, pin listing, system management bus, signal definitions for the Intel® Itanium® processor 9300/9500 series.

Electrical, thermal, and mechanical specs, pin listing, system management bus, signal definitions for the Intel® Itanium® processor 9300/9500 series.

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Intel® Instruction Replay Technology Detects and Corrects Errors
White Paper: New Intel® Itanium® processor has Instruction Replay technology, which identifies potential errors and corrects them almost instantly.

White Paper: New Intel® Itanium® processor has Instruction Replay technology, which identifies potential errors and corrects them almost instantly.

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Sunny Days Ahead for AccuWeather*
Case Study: AccuWeather* reduces app runtime by upgrading its environment with HP Converged Infrastructure*, improving service and forecasting.

Case Study: AccuWeather* reduces app runtime by upgrading its environment with HP Converged Infrastructure*, improving service and forecasting.

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Slovenian Bank Boosts Payment Service Availability, Security
Case Study: Bankart gains processing and payment service availability and security using HP Integrity NonStop BladeSystem* for less TCO and more ROI.

Case Study: Bankart gains processing and payment service availability and security using HP Integrity NonStop BladeSystem* for less TCO and more ROI.

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