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Itanium®-based servers deliver powerful and scalable performance for UNIX and mainframe environments.
Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.
Case Study: Sky Italia cuts software processing time and power consumption migrating to Itanium® processor-based HP Superdome2* servers for lower TCO.
Software development and optimization guide for the Intel® Itanium® processor 9500 series with microarchitectural description and performance info.
Reference manual for the Dual-Core Intel® Itanium® 2 processor on software development and optimization.
Manual: Intel® Itanium® Architecture Software Developer's Manual, Vol. 4: IA-32 Instruction Set.
Architecture Guide: Intel® Itanium® software conventions and runtime. Does not define operating-system interfaces.
Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.
Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.
Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.
Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.
Packaging Databook, Ch. 13: Plastic Pin Grid Array Package technology, and its physical structure, electric modeling and performance.
Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.
White Paper: Enhanced reliability, availability, and serviceability (RAS) of Intel® processor-based server platforms simplify business solutions.
Defines core code for an implementation of the Pre-EFI Initialization phase of the Intel® Platform Innovation Framework for EFI.
Defines the required core code and services for the Pre-EFI Initialization (PEI) phase of the Intel® Platform Innovation Framework for EFI.
Electrical, thermal, and mechanical specs, pin listing, system management bus, signal definitions for the Intel® Itanium® processor 9300/9500 series.
White Paper: New Intel® Itanium® processor has Instruction Replay technology, which identifies potential errors and corrects them almost instantly.
Case Study: Bankart gains processing and payment service availability and security using HP Integrity NonStop BladeSystem* for less TCO and more ROI.