Thermal mechanical components
For the Intel® Core™ i3 processor with thermal design power of 73W or less.
Suppliers of support components have developed products for Intel Core i3 processor family based system designs. The listed vendors supply support components for processors in 1156-Land and 1155-Land LGA package. Some vendor products may follow design guidelines listed on the technical documents page.
Intel-enabled vendors
This section includes supplier information for Intel-enabled vendors for the Intel Core i3 processor. These suppliers may produce both Intel-enabled and non-Intel-enabled solutions.
Note: End-users are responsible for the verification of the component offerings with the supplier. OEM and system integrators are responsible for thermal, mechanical, and environmental validation of these solutions.
LGA 1155 socket, 1156 socket and ILM components
| Supplier | Part description | Intel part number | Contact | Phone | |
|---|---|---|---|---|---|
| Foxconn* |
LGA1155 Socket |
E52846-002 |
Julia Jiang |
+1-408-919-6178 |
juliaj@foxconn.com |
| LGA1156 Socket | E51948-003 | ||||
| LGA115x ILM with Cover | G11449-002 | ||||
| LGA115x ILM without Cover | E36142-002 | ||||
| LGA115x ILM Cover Only | G12451-001 | ||||
| Back Plate (with screws) | E36143-002 | ||||
| Lotes* | LGA1155 Socket | E52846-002 | Windy Wong | +1-604-721-1259 | windy@lotestech.com |
| LGA1156 Socket | E51948-003 | ||||
| LGA115x ILM with Cover | G11449-002 | ||||
| LGA115x ILM without Cover | E36142-002 | ||||
| LGA115x ILM Cover Only | G12451-001 | ||||
| Back Plate (with screws) | E36143-002 |
||||
| Molex* | LGA1155 Socket |
E52846-002 |
Carol Liang | +86-21-504-80889-x3301 | carol.liang@molex.com |
| LGA1156 Socket | E51948-003 | ||||
| LGA115x ILM without Cover | E36142-002 | ||||
| Back Plate (with screws) | E36143-002 | ||||
| Tyco* | LGA1155 Socket |
E52846-002 |
Billy Hsieh | +886-2-8768-2788 x617 | billy.hsieh@te.com |
| LGA1156 Socket | E51948-003 | ||||
| LGA115x ILM with Cover | G11449-002 | ||||
| LGA115x ILM without Cover | E36142-002 | ||||
| LGA115x ILM Cover Only | G12451-001 | ||||
| Back Plate (with screws) | E36143-002 | ||||
| ITW Fastex* | LGA115x ILM without cover | E36142-002 | Chak Chakir | +1-512-989-7771 | chak.chakir@itweba.com |
| LGA115x ILM Back Plate (with screws) | E36143-002 | ||||
| LGA115x ILM with Cover | G11449-002 | ||||
| LGA115x Cover Only | G12451-001 |
Heatsinks for Intel® Core™ i3 processors with thermal design power of 73W or less
| Supplier | Part description | Intel part number | Contact | Phone | |
|---|---|---|---|---|---|
| Nidec* | Intel® RCFH7-115x Reference Heatsink (DHA-A) | E41759-002 | Karl Mattson | +1 360 666 2445 | karl.mattson@nidec.com |
| Delta* | Intel® RCFH7-115x Reference Heatsink (DHA-A) | E41759-002 | Jason Tsai | +1-503-533-8444 x111 +1-503-539-3547 |
jtsai@delta-corp.com |
| Foxconn* | Intel® RCFH7-115x Reference Heatsink (DHA-A) | E41759-002 | Julia Jiang | +1-408-919-6178 | juliaj@foxconn.com |
| Nidec* | Intel® RCFH6-115x Reference Heatsink (DHA-B) | E41997-002 | Karl Mattson | +1 360 666 2445 | karl.mattson@nidec.com |
| Delta* | Intel® RCFH6-115x Reference Heatsink (DHA-B) | E41997-002 | Jason Tsai | +1-503-533-8444 x111 +1-503-539-3547 |
jtsai@delta-corp.com |
| Foxconn* | Intel® RCFH6-115x Reference Heatsink (DHA-B) | E41997-002 | Julia Jiang | +1-408-919-6178 | juliaj@foxconn.com |
Fasteners
| Supplier | Part description | Part number | Contact | Phone | |
|---|---|---|---|---|---|
| ITW Fastex* | Fastener | Base: C33389 Cap: C33390 |
Chak Chakir | +1 512 989 7771 | chak.chakir@itweba.com |
Alternate support components
The following suppliers have developed cooling solutions for the Intel Core i3 processor-based system designs. These were independently tested by an Intel-enabled, third-party test house. These suppliers may produce both compliant and non-compliant solutions in addition to what is listed below. Please regularly consult this page for updated information on heatsink vendor status.
Note: End-users are responsible for the verification of the component offerings with the supplier. OEM and system integrators are responsible for thermal, mechanical, and environmental validation of these solutions.
Heatsinks for Intel Core i3 processors with thermal design power of 73W or less
| Supplier | Part number | Contact | Phone | |
|---|---|---|---|---|
| Akasa Asia Corp.* | AK-CC067 | Yiyen Chen | +886 2 2999 6289 | sales@akasa.com.tw |
| AVC* | Z8UL06L002 | Kai Chang | +86 755 33668888 x63588 | kai_chang@avc.com.tw |
| AMA* | 90-ZBC258306 | Doris Yu | +886 952 083222 | doris_yu@amatech.com |
| Cooler Master* | ECC-S0782-01-GP | Barkley | +886 918539632 | barkley_hsaing@coolermaster.com.tw |
| Dynatron* | K786 | Ian Lee | +1 510 498 8888 x116 | ian@dynatron-corp.com |
| These heatsinks were tested for compliance to thermal and mechanical requirements. | ||||
| Supplier | Part number | Contact | Phone | |
|---|---|---|---|---|
| Thermaltake* | CLP0550 | Sean Li | +886 2 26626501 x235 +886 922036128 |
sean@thermaltake.com.tw |
| Kwo Ger Metal Technology, Inc* | 0772-0421R | Rosewire Kuo | +886 2 26832868 x173 | rosewire@kwoger.com.tw |
