The Intel® E8500 chipset a high performance, scalable platform offered in the 64-bit Intel® Xeon® processor family. Intel's sixth-generation four-way MP platform is architected for dual-core CPUs, and it is compatible with Intel's single-core processors, giving it an enhanced lifespan and helping to lower Total Cost of Ownership (TCO).
In addition, the Intel® E8500 chipset offers enhanced performance, increased bandwidth, and greater flexibility, manageability, and I/O integration than Intel's previous generation MP chipsets. Plus, it is available in a variety of configurations suitable for a wide range of price points and application environments.
Product information
-
File Type/Size: PDF 290KB
- Server Chipset Comparison Chart
- Visit Product Support Page
| Related products | |
| Processors |
|
| Chipsets | |
| Server systems | |
| Other | |
| Features and benefits | |
|---|---|
| Architected for dual-core CPUs and compatible with Intel's current single-core processors. | Enhanced lifespan and helps to lower Total Cost of Ownership (TCO). |
| DDR-266, DDR-333 or DDR2-400 | DDR-266, DDR-333 or DDR2-400 memory-based subsystems offer reduced latency while consuming less power than previous generations. |
| Up to 8 MB cache | Up to 8 MB cache from 64-bit Intel® Xeon® processors MP for fast response times. |
| Demand-Based Switching (DBS) with Enhanced Intel SpeedStep® Technology | Gives you the advantage of power savings and increased system density for server applications and helps improve workstation acoustics. |
| Intel® Extended Memory 64 Technology (Intel® EM64T) | Extends flat memory addressability beyond 4 GB. |
| Intel® Streaming SIMD Extensions 3 (Intel® SSE 3) | Includes thirteen additional SIMD instructions over SSE2. The new instructions are primarily designed to improve thread synchronization and specific application areas such as media and gaming. |
| Hyper-Threading Technology enhancements | Hyper-Threading enhancements help increase server application performance. |
| PCI Express* I/O capability with 3X8 and 1X4 lanes | PCI Express* offers greater performance headroom and bandwidth efficiency than previous generations. |
Additional information: 1 2
Technische gegevens
Meer technische documenten bekijken >-
Intel® E8500 Chipset XMB...
Datasheet: Intel® E8500 chipset External Memory Bridge (XMB).
Preview | Download -
Datasheet, Intel® E8500...
Describes the features, modes and registers supported by the Intel® E8500 chipset North Bridge component...
Preview | Download -
Intel® 82801EB ICHAS R:...
Datasheet: Intel® 82801EB I/O Controller Hub 5 and Intel® 82801ER I/O Controller Hub 5 R.
Preview | Download -
Datasheet, Intel®...
Intel® 6700PXH 64-bit PCI Hub: peripheral chip bridges PCI functions between PCI Express*, PCI Bus.
Preview | Download
-
Intel® E8500 Chipset...
Thermal/Mechanical Design Guide: Intel® E8500 Chipset North Bridge and external Memory Bridge
Preview | Download -
Intel® E8500/E8501...
Thermal, Mechanical Design Guide for Intel® E8500 and Intel® E8501 Chipsets and External Memory Bridge.
Preview | Download -
Thermal Guide, Intel®...
Thermal and Mechanical Design Guide: Intel® 82801EB I/O Controller Hub 5, Intel® 82801EB I/O Controller...
Preview | Download -
Intel® E7505 Chipset:...
Recommendations for systems based on Intel® Xeon® processor with 512-KB L2 cache.
Preview | Download
-
Intel® E8501 Chipset XMB
Intel® E8501 Chipset eXternal Memory Bridge (XMB), clarifications, changes, and documentation errata.
Preview | Download -
Intel® E8500 Chipset...
Specification Update, 2007: Intel® E8500 Chipset eXternal Memory Bridge (XMB).
Preview | Download -
Spec Update, Intel®...
Intel® E8500 Chipset North Bridge covers errata, specification changes and clarifications, and document...
Preview | Download -
Intel® E8501 Chipset...
Intel® E8501 Chipset North Bridge covers errata, specification changes and clarifications, and document...
Preview | Download
| Packaging information | |
| Intel® E8500 TNB .13um Technology (MP Server Northbridge) | 1432-pin Flip Chip-Ball Grid Array (FC-BGA3) Package |
| Intel® E8500 XMB .13um Technology (ECC MP Server) | 829-pin Flip Chip-Ball Grid Array (FC-BGA3) Package |


