Update to the Intel® 7 Series Chipset Family Platform Controller Hub, including device and document errata, and spec clarifications and changes.
Note: Describes use of the thermal test vehicle for the Intel® Xeon® processor 5600/5500 series and provides power through land/pad. (v.1a, Aug. 2007)
Thermal Guide: Solution and design parameters for embedded applications of the Intel® Xeon® processor 5200 series in small form factors. (Sept. 2008)
White Paper: Guidelines for implementing programmable logic controllers using Intel® technology that supports real-time control. (v.1, Jan. 2010)
Outlines an energy-efficient, high-performance platform for thermally constrained applications that expands service provider options.
Spec Update: Errata and changes on the Intel® Communications Chipset 89xx Series Datasheet for hardware and system developers. (v.001, Oct. 2012)
Design Guide: Thermal and mechanical design specifications for the Intel® Communications Chipset 89xx Series. (v.001, Oct. 2012)
Use this tool to model the thermal characteristics of the Intel® Xeon® Processor 5000 Series.
Brief: The Intel® Communications Chipset 89xx Series in Intel® Xeon® processor-based platforms provides scalability for communication infrastructures.
External Design Specification: Intel® 7/C216 Series Chipset Platform Controller Hub electrical, signal, and thermal specs. (v.002.2, July 2012)