Intel® EP80579 Integrated Processor Product Line: Thermal Guide
The power dissipation required for electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.
The goals of this document are to:
• Describe the thermal and mechanical specifications for Intel® EP80579 Integrated Processor product line
• Describe reference solutions that meet the Intel® EP80579 Integrated Processor product line’s thermal and mechanical specifications
Read the full Intel® EP80579 Integrated Processor Product Line Thermal Design Guide.
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Intel® EP80579 Integrated Processor Product Line: Thermal Guide
The power dissipation required for electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.
The goals of this document are to:
• Describe the thermal and mechanical specifications for Intel® EP80579 Integrated Processor product line
• Describe reference solutions that meet the Intel® EP80579 Integrated Processor product line’s thermal and mechanical specifications
Read the full Intel® EP80579 Integrated Processor Product Line Thermal Design Guide.
