Intel's Packaging Databook Chapter 13: Pinned Packaging
Pinned Packaging 13
As Intel® microprocessors become faster, more complex, and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal, and mechanical performance. Package electrical and thermal characteristics become attributes of component performance along with the mechanical protection offered by the package.
To meet these requirements, Intel has introduced a variety of innovative package designs. The development of the plastic pin grid array (PPGA) package, PPGA2, and Flip Chip Pin Grid Array (FC-PGA) have provided an improvement path for enhanced power distribution and improved thermal and electrical performance. While each consists of organic package materials, the primary differences within the package is that PPGA utilizes wire bond interconnect technology while the FC-PGA utilizes Flip Chip Interconnect. Externally, the PPGA thermal interface will be made to an integral package heat slug while the FC-PGA thermal interface will be made directly to the die backside. PPGA and FC-PGA are both socket compatible. The sections detail the physical structure, electrical modeling, and performance attributes of the PPGA package.
Read the full Intel Packaging Databook, Ch. 13.
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Intel's Packaging Databook Chapter 13: Pinned Packaging
Pinned Packaging 13
As Intel® microprocessors become faster, more complex, and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal, and mechanical performance. Package electrical and thermal characteristics become attributes of component performance along with the mechanical protection offered by the package.
To meet these requirements, Intel has introduced a variety of innovative package designs. The development of the plastic pin grid array (PPGA) package, PPGA2, and Flip Chip Pin Grid Array (FC-PGA) have provided an improvement path for enhanced power distribution and improved thermal and electrical performance. While each consists of organic package materials, the primary differences within the package is that PPGA utilizes wire bond interconnect technology while the FC-PGA utilizes Flip Chip Interconnect. Externally, the PPGA thermal interface will be made to an integral package heat slug while the FC-PGA thermal interface will be made directly to the die backside. PPGA and FC-PGA are both socket compatible. The sections detail the physical structure, electrical modeling, and performance attributes of the PPGA package.
Read the full Intel Packaging Databook, Ch. 13.
