Intel® Celeron® Processor 400 Series: Thermal Design Guide
The objective of thermal management is to ensure that the
temperatures of all components in a system are maintained within their functional temperature range. Within this
temperature range, a component is expected to meet its specified performance. Operation outside the functional temperature
range can degrade system performance, cause logic errors or cause component and/or system damage. Temperatures exceeding
the maximum operating limit of a component may result in irreversible changes in the operating characteristics of this
component.
In a system environment, the processor temperature is a function of both system and component thermal
characteristics. The system level thermal constraints consist of the local ambient air temperature and airflow over the
processor as well as the physical constraints at and above the processor. The processor temperature depends in particular
on the component power dissipation, the processor package thermal characteristics, and the processor thermal
solution.
All of these parameters are affected by the continued push of technology to increase processor performance
levels and packaging density (more transistors). As operating frequencies increase and packaging size decreases, the power
density increases while the thermal solution space and airflow typically become more constrained or remains the same within
the system. The result is an increased importance on system design to ensure that thermal design requirements are met for
each component, including the processor, in the system.
Document Goals
Depending on the type of system and
the chassis characteristics, new system and component designs may be required to provide adequate cooling for the
processor. The goal of this document is to provide an understanding of these thermal characteristics and discuss guidelines
for meeting the thermal requirements imposed on single processor systems using Intel® Celeron® Processor 400
series.
Read the full Intel® Celeron® Processor 400 Series Thermal Design Guide.
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Intel® Celeron® Processor 400 Series: Thermal Design Guide
The objective of thermal management is to ensure that the
temperatures of all components in a system are maintained within their functional temperature range. Within this
temperature range, a component is expected to meet its specified performance. Operation outside the functional temperature
range can degrade system performance, cause logic errors or cause component and/or system damage. Temperatures exceeding
the maximum operating limit of a component may result in irreversible changes in the operating characteristics of this
component.
In a system environment, the processor temperature is a function of both system and component thermal
characteristics. The system level thermal constraints consist of the local ambient air temperature and airflow over the
processor as well as the physical constraints at and above the processor. The processor temperature depends in particular
on the component power dissipation, the processor package thermal characteristics, and the processor thermal
solution.
All of these parameters are affected by the continued push of technology to increase processor performance
levels and packaging density (more transistors). As operating frequencies increase and packaging size decreases, the power
density increases while the thermal solution space and airflow typically become more constrained or remains the same within
the system. The result is an increased importance on system design to ensure that thermal design requirements are met for
each component, including the processor, in the system.
Document Goals
Depending on the type of system and
the chassis characteristics, new system and component designs may be required to provide adequate cooling for the
processor. The goal of this document is to provide an understanding of these thermal characteristics and discuss guidelines
for meeting the thermal requirements imposed on single processor systems using Intel® Celeron® Processor 400
series.
Read the full Intel® Celeron® Processor 400 Series Thermal Design Guide.
