Our system platforms combine cost-optimized ICs, reference designs, and feature-rich software stacks with professional customer support throughout the value chain. Its small size together with the flexible, modular concept of our system platform offers you the possibility to leverage one design into various fields of applications such as mobile phones, mobile computing or telematics.
Product list and key features
| Product | Protocol | Description | Features |
|---|---|---|---|
Intel® XMM™ 1010 |
GSM/GPRS | Based on X-GOLD™ 101, with the XMM™1010 platform Intel pioneered the Ultra-Low Cost market with a revolutionary 2G baseband and platform solution. | • Industry first phone on a chip: baseband, RF engine, power management and memory • Enable low BOM for black and white handsets • Best in class GSM/GPRS modem |
Intel® XMM™ 1100 |
GSM/GPRS | Based on X-GOLD™ 101, the XMM™1010 platform is a ULC feature evolution, 65nm „phone on a chip“ integrating additional functionality such as FM Radio, MP3 and sufficient memory to support a colour display phone without external SRAM. | • GSM, Dual SIM • Lowest BOM by integrated FM Radio, SRAM, serial Flash and low cost PCB • Lowest power consumption – less than 1mA idle current, best in class talk current |
Intel® XMM™ 1180 |
GSM/GPRS | Based on X-GOLD™ 118, the XMM™1180 platform is a GPRS System on a Chip in 65nm, the high integration and possibility to use low cost PCB makes it possible to ideal solution for lowest cost messaging and multimedia phones. | • GPRS with great multimedia performance & user experience • Dedicated 1.3Mp Camera support, integrated FM-Radio, MP3 and USB • Lowest power consumption – best in class talk current |
| Intel® XMM™ 2130 / XMM™ 2150 |
EDGE | Based on X-GOLD™ 213/215, the XMM™2150/2150 platform is an EDGE System on a Chip in 65nm with multimedia performance typical for higher segments. The high integration level and possibility to use low cost PCB makes it possible to develop lowest cost EDGE browsing and multimedia phones. | • EDGE downlink at cost of GPRS, enabling low-cost mobile browsing • Powerful CPU for great multimedia performance • Common software architecture for scalability from 2G to 3G • Integrated FM-Radio • Lowest power consumption – best in class talk current |
| Intel® XMM™ 2231 | EDGE | Form Factor Reference Design based on XGOLD223 EDGE 65nm SOCs. | • 3.2-inch capacitive touchscreen, 3Mpixel camera, connectivity (WIFI, A-GPS, BT, FM Radio), Motion sensor, Electronic compass, Proximity & ambient light sensor and slim metal-like case. • Android 2.2, updated planned to 2.3 • Scalability to 3.5-inch HVGA • Quad band EDGE |
| Intel® XMM™ 6130 | HSDPA | Based on X-GOLD™ 213 and SMARTI™ UE RF transceiver, the Intel® XMM™ 6130 Phone Platform is a cost-optimized 3G feature phone solution enabling affordable mobile broadband devices for Emerging Markets. | • Cost-effective platform for rich multi-media and browsing experience • Common CPU architecture enables scalability from 2G to 3G • Worldwide proven HSDPA Rel.6 modem stack |
| Intel® XMM™ 6160 |
HSPA | Based on X-GOLD™ 616 Digital- and Analog Baseband with integrated Power Management Unit and the 2G/3G Transceiver SMARTi™ UE, the XMM™ 6160 platform is an easy upgrade from the XMM™ 6080 as both are based on the Intel Comneon Protocol Stack. | • HSDPA/HSUPA capabilities of 7.2Mbps/5.7Mbps with EDGE multislot class 12 • Hardware and software interface to an application processor or a PC as wireless modem • LP-DDR1 and NAND memory support |
| Intel® XMM™ 6260 |
HSPA+ | Based on X-GOLD™ 626 Digital- and Analog Baseband with integrated Power Management Unit and the 2G/3G Transceiver SMARTi™ UE2, the XMM™ 6260 platform is the smallest available HSPA+ modem supporting a global connectivity within one stock keeping unit. | • HSDPA/HSUPA capabilities of 21Mbps/5.7Mbps with EDGE multislot class 33 • Penta-band 3G, Quad-band EDGE with Receive Diversity type 3i • Supports worldwide connectivity in one design • Extremely small PCB footprint and power consumption • Hardware and software interfaces to applications processors or to a PC as a wireless modem |
| Intel® XMM™ 6360 | DC-HSPA | • Based on X-GOLD™ 636 Digital- and Analog Baseband with integrated Power Management Unit and the 2G/3G Transceiver SMARTi™ UE3, the XMM™ 6360 multimode platform is the smallest available DC-HSPA modem supporting a global connectivity within one stock keeping unit. | HSDPA/HSUPA capabilities of 42Mbps/11.5Mbps with EDGE multislot class 33 • Multi-band Penta-band 3G, Quad-band EDGE for worldwide connectivity • Supports worldwide connectivity in one design • Excellent power consumption and extremely small PCB footprint • Hardware and software interfaces to applications processors or to a PC as a wireless modem |
| Intel® XMM™ 7160 | Multimode LTE & DC-HSPA | Based on X-GOLD™ 716 Digital- and Analog Baseband with integrated Power Management Unit and the 2G/3G/LTE Transceiver SMARTi™ 4G, the XMM™ 7160 multimode platform is the most compact solution for LTE/DC-HSPA Smart Phones for worldwide deployment. | • LTE capabilities of 100Mbps/50Mbps • HSDPA/HSUPA capabilities of 42Mbps/11.5Mbps with EDGE multislot class 33 • Multi-band LTE, Penta-band 3G, Quad-band EDGE for worldwide connectivity • Excellent power consumption and extremely small PCB footprint • Hardware and software interfaces to applications processors or to a PC as a wireless modem |
