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Intel's Packaging Databook Chapter 1: Introduction
Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.

Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.

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Intel's Packaging Databook Chapter 3: Alumina and Leaded Molded Technology: Packaging
Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.

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Intel's Packaging Databook Chapter 7: Leaded Surface Mount Technology (SMT)
Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

Packaging Databook Ch 7: leaded surface mount technology enables more reliable assemblies with higher I/O, board density, and less weight and cost.

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Intel's Packaging Databook Chapter 11: International Packaging Specifications
Packaging Databook, Ch. 11: international packing specifications with rules and standards.

Packaging Databook, Ch. 11: international packing specifications with rules and standards.

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Intel's Packaging Databook Chapter 5: Physical Constants of IC Package Materials
2000 Packaging Databook, Chapter 5: Physical constants of IC package materials.

2000 Packaging Databook, Chapter 5: Physical constants of IC package materials.

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Intel's Packaging Databook Chapter 4: IC Packages Performance Characteristics: Packaging
Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.

Packaging Databook, Ch. 4: basic package modeling terminology, methodology, and experimental characterization, and modeled data for the packages.

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Intel's Packaging Databook Chapter 12: Tape Carrier Package
Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

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Intel's Packaging Databook Chapter 16: Cartridge Packaging
Packaging Databook, Ch. 16: The Single Edge Contact Cartridge and its physical structure, electrical modeling, and performance.

Packaging Databook, Ch. 16: The Single Edge Contact Cartridge and its physical structure, electrical modeling, and performance.

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Solve Power and Cooling Challenges for Effective Computing
White Paper: Intel® Xeon® and Intel® Itanium® processor-based servers scale effective computing capabilities and lower power and cooling costs.

White Paper: Intel® Xeon® and Intel® Itanium® processor-based servers scale effective computing capabilities and lower power and cooling costs.

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Intel and Red Hat Take Mission-Critical Capability to New Heights
Solution Brief covers mission-critical enterprise computing capabilities with Red Hat Enterprise Linux 6* and the Intel® Xeon® processor E7 family.

Solution Brief covers mission-critical enterprise computing capabilities with Red Hat Enterprise Linux 6* and the Intel® Xeon® processor E7 family.

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Intel Processor Identification and the CPUID Instruction
Application Note: how to use the CPUID instruction in software applications, BIOS implementations, and various processor tools.

Application Note: how to use the CPUID instruction in software applications, BIOS implementations, and various processor tools.

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No Compromise Performance and Security with Oracle’s Intel-based Systems
White paper: Organizations can take advantage of the security, performance, and economic benefits of Oracle servers* using Intel® Xeon® processors.

White paper: Organizations can take advantage of the security, performance, and economic benefits of Oracle servers* using Intel® Xeon® processors.

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Intel® Xeon® Processor MP with 1MB L2 Cache Datasheet
Intel® Xeon® processor MP with 1MB L2 Cache.

Intel® Xeon® processor MP with 1MB L2 Cache.

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Intel® Xeon® E7 Processor Family: Product Demo [71 K]
Product demo outlines Intel® Xeon® E7 processor family benefits including low total cost of ownership, high security, scalability, and reliability.

Product demo outlines Intel® Xeon® E7 processor family benefits including low total cost of ownership, high security, scalability, and reliability.

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Intel® Xeon® Processor 7500 Series: Thermal/Mechanical Guide
Thermal and Mechanical Design Guide: Intel® Xeon® Processor 7500 Series and Intel® Xeon® Processor E7-8800/4800/2800 Product Families.

Thermal and Mechanical Design Guide: Intel® Xeon® Processor 7500 Series and Intel® Xeon® Processor E7-8800/4800/2800 Product Families.

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Intel® Xeon® Processor E7 Family Uncore Performance Monitoring
Guide: Intel® Xeon® Processor E7 Family Uncore Performance Monitoring and Programming Guide.

Guide: Intel® Xeon® Processor E7 Family Uncore Performance Monitoring and Programming Guide.

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Intel® Xeon® Processor E7-8800/4800/2800: Datasheet, Vol. 1
Intel® Xeon® processor E7-8800/4800/2800 product families Datasheet, Vol. 1: Electrical, mechanical, thermal specifications.

Intel® Xeon® processor E7-8800/4800/2800 product families Datasheet, Vol. 1: Electrical, mechanical, thermal specifications.

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Intel® Xeon® Processor E7-8800/4800/2800 Families
Intel® Xeon® processor E7-8800/4800/2800 product families Datasheet, Vol. 2: Electrical, mechanical, thermal specifications.

Intel® Xeon® processor E7-8800/4800/2800 product families Datasheet, Vol. 2: Electrical, mechanical, thermal specifications.

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Intel® Socket Test Technology for LGA771
This document includes the theory on which Intel® Socket Test Technology is based, typical test methods, and device specification for LGA771.

This document includes the theory on which Intel® Socket Test Technology is based, typical test methods, and device specification for LGA771.

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Intel Xeon E7-Prozessoren: Zuverlässigkeit von Enterprise-Servern [95 K]
Intel Xeon E7-Prozessoren sind mit ihren hochentwickelten Zuverlässigkeitsmerkmalen ideal für die unternehmenskritische EDV und für umfassend virtualisierte Wo...

Intel Xeon E7-Prozessoren sind mit ihren hochentwickelten Zuverlässigkeitsmerkmalen ideal für die unternehmenskritische EDV und für umfassend virtualisierte Workloads geeignet.

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Video: Oracle Sun Fire* Server mit Intel® Xeon® E7-Prozessoren [74 K]
Video: Oracle-Systeme Sun Fire X4470 M2* und Sun Fire X4800 M2* und Intel® Xeon® E7-Prozessoren tragen zur Neudefinition von Rechenzentren bei.

Video: Oracle-Systeme Sun Fire X4470 M2* und Sun Fire X4800 M2* und Intel® Xeon® E7-Prozessoren tragen zur Neudefinition von Rechenzentren bei.

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Measuring Processor Power: TDP vs. ACP
White Paper covers how Intel and AMD* specify processor power for server processors, and how to compare processors from each manufacturer.

White Paper covers how Intel and AMD* specify processor power for server processors, and how to compare processors from each manufacturer.

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TPoX Benchmarks: Intel® Xeon® Processor E7-4800 Family - Server [80 K]
TPoX is an on-line transation processing (OLTP) XML database benchmark based on a financial scenario focusing heavily on transactions.

TPoX is an on-line transation processing (OLTP) XML database benchmark based on a financial scenario focusing heavily on transactions.

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Zuverlässigkeit für die Unternehmens-EDV [69 K]
Die Reihe der Intel Xeon E7-Prozessoren ist für die größten, anspruchsvollsten Computerlösungen, die in der IT großer Unternehmen eingesetzt werden, vorgesehen.

Die Reihe der Intel Xeon E7-Prozessoren ist für die größten, anspruchsvollsten Computerlösungen, die in der IT großer Unternehmen eingesetzt werden, vorgesehen.

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Measuring Memory Bandwidth on Intel® Xeon® Processor 7500 Platform
White Paper: How to reproduce memory bandwidth measurements for Intel® Xeon® processor 7500 series platform.

White Paper: How to reproduce memory bandwidth measurements for Intel® Xeon® processor 7500 series platform.

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