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Context-Aware Connected Embedded Mobile Devices
Unified Configuration Demo Using Intel® vPro™ Field Image Kit
Intel® Active Management Technology Enhances Embedded Computing
Intel® Power Management Technology for Embedded Applications
Minimize the Impact of Virtualization
Challenge of University Embedded Education at Tsinghua University
Enhance Embedded System Security with Intel® AES-NI
TechTalk: Thermal Test Vehicles
Video: Intel® Virtualization Technology for Embedded Applications
Embedded Research at the Indian Institute of Science
Software Development Tools for Embedded Systems
Diagnose Hard Drive Failure Remotely
Configure PCI-Express* Lanes for Simultaneous Applications
Safe, Secure, and Sustainable Body Area Networks
Intel® Atom™ Processor Solutions for Deeply Embedded Market
Thermal and Mechanical Guide: Specifications for processor and socket. (v.2.3, Dec. 2010)
Spec, Vol. 1: Power, thermal, interface, signal, and electrical specs. (v.2.1, Feb. 2011)
App Note: Clarifies various aspects of programming serial flash.
Thermal and Mechanical Guide: Specifications for two processor series and socket. (Jan. 2011)预览 | 下载
单端口收发器可连接到平台的集成介质访问控制器。
先前为 Tolapai
控制器在多核平台和虚拟平台中提供高性能双端口千兆位连接。
带嵌入式控制器的服务器在数据中心内提供卓越的性能扩充能力。