Intel's Packaging Databook Chapter 11: International Packaging Specifications
Joint Electron Device Engineering Council (JEDEC)
JEDEC Publication 95 lists all package outlines. More information about JEDEC can be located on their web site at http://www.jedec.org.
Mil Standards
The following military standards include specifications required to meet U. S. Military requirements.
• MIL-M-38510 General Specifications for Microcircuits
• MIL-STD-883 Test Methods/Procedures for Microelectronics
For a list of SEMI standards, reference the Book of SEMI Standards, 1990, Vol.4, Packaging Division, 605 E. Middlefield Road, Mountain View, CA 94043, U.S.A. Phone:(415) 964-5111. FAX: (415) 967-5375. TELEX: 856-777 SEMI-MNTV
Read the full Packaging Databook, Ch. 11.
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Intel's Packaging Databook Chapter 11: International Packaging Specifications
Joint Electron Device Engineering Council (JEDEC)
JEDEC Publication 95 lists all package outlines. More information about JEDEC can be located on their web site at http://www.jedec.org.
Mil Standards
The following military standards include specifications required to meet U. S. Military requirements.
• MIL-M-38510 General Specifications for Microcircuits
• MIL-STD-883 Test Methods/Procedures for Microelectronics
For a list of SEMI standards, reference the Book of SEMI Standards, 1990, Vol.4, Packaging Division, 605 E. Middlefield Road, Mountain View, CA 94043, U.S.A. Phone:(415) 964-5111. FAX: (415) 967-5375. TELEX: 856-777 SEMI-MNTV
Read the full Packaging Databook, Ch. 11.
