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Update to the Intel® Xeon® Processor E3-1200 v2 Product Family: Datasheet, Vol. 1-2, including device and document errata, clarifications, changes.
Mechanical and thermal specs for the processor, and LGA1155 socket and reference design heatsink solution for the associated retention hardware.
Configuration space registers or device-specific control and status registers, but does not include model specific registers.
DC specifications, pinout and signal definitions, interface functional descriptions, and additional feature info for implementation and operation.
White Paper: Micro servers, many Intel® architecture-based small compute nodes, address emerging workload needs with improved efficiency and density.
Datasheet, Vol. 1: Intel® Xeon® processor E3-1200 family built on 32-nanometer process technology.
Datasheet, Vol. 2: Intel® Xeon® processor E3-1200 family built on 32-nanometer process technology.
See how ECC memory in Intel® Xeon® processor-based servers detects and corrects single-bit errors, preventing data corruption and computer crashes.
测试结果表明:“E7-4860 平台不仅在性能上比 X7560 平台提升了 21%,而且它在长时间的与数据库相关的工作负载的测试下,还提供了很好的稳定性与可靠性。”卓望对这些测试成绩很满意,并认为全新的至强 E7 处理器“支持提升应用的安全可靠性,可用于打造高效可靠的运行平台!”
This document contains updates to Intel® Xeon® E3-1200 Family. It is a compilation of device and documentation clarifications and changes.