Thermal and Mechanical Design Guide: Intel® Atom™ processor 200 series.
See how less equals more with Intel® Xeon® processors, providing power savings, scalability, integration, real estate, and workload consolidation.
Design Guide: Thermal and mechanical design specifications for the Intel® Communications Chipset 89xx Series. (v.001, Oct. 2012)
Guide: Thermal solutions and design parameters for the dual-core Intel® Core™2 Duo processor E8000/E7000 series that demonstrate cooling features.
Article: Software workload affects energy consumption, but developers who use efficiency techniques achieve superior power results. (v.1, July 2011)
Updates Intel® Atom™ processor N2000/D2000 series embedded application power guidelines with power numbers from real life applications.
White Paper: Reference fanless cooling solution for embedded point-of-sale application design considerations utilizes CFD simulation. (Jan. 2009)
Intel® Xeon® Processor E5-1600, E5-2600, and E5-4600 Product Families – Mechanical Models
Thermal/mechanical, and heatsink design solutions for server and workstation processors in the Intel® Xeon® processor E5-2400 product family platform.
Thermal and mechanical operating limits and reference thermal solutions for the Intel® 7 Series Chipset.