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Discover how to implement server migration from expensive, proprietary platforms to Intel® technology-based solutions for mission-critical needs.
Size workloads for implementation on standards Intel® Itanium® processor, Intel® Xeon® processor HP Integrity* or ProLiant* server platforms.
Intel® processor comparison guide helps select from a range of server platforms based on proven, efficient technology to meet your enterprise needs.
Defines core code for an implementation of the cache data hub subclass of the Intel® Platform Innovation Framework for EFI.
Os servidores Intel® proporcionam desempenho aprimorado e eficiente no uso de energia para aplicativos para empresas com uso intenso de dados.
Chapter 2 Package / Module / PC Card Outlines and Dimensions: A detailed view of Intel package outlines and dimensions.
Packaging Databook, Ch. 3: packaging technologies for assembling three types of component packages for alumina and leaded molded technology.
Packaging Databook, Ch. 6: Electrical static discharge and electrical over stress.
Packaging Databook, Chapter 8: Moisture sensitivity/desiccant packaging/PSMCs handling.
Packaging Databook, Ch.9: solder paste printing, component placement, reflow soldering, and rework.
Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.
Electrical, thermal, and mechanical specs, pin listing, system management bus, signal definitions for the Intel® Itanium® processor 9300/9500 series.
Case Study: HP servers provide reliable development trading system for Shanghai Stock Exchange, enabling growth for real-time processing, security.
Case Study: MøllerGruppen reduces operation costs, minimizes business disruption, and provides a platform for growth with a HP mainframe migration.
Case Study: Dutch mobile communications provider KPN handles fast-growing transaction volume with less costs and greater performance using HP.
BayWa Group enjoys increased performance and stable costs with new IT infrastructure that improves SAP applications' response time by 20 percent.
Datasheet: Intel® 7500 Scalable Memory Buffer Datasheet.
Boundary-Scan Description Language (BSDL) File: Intel® 7500 Scalable Memory Buffer.
This document contains updates to Intel® 7500 Scalable Memory Buffer. It is a compilation of device and documentation clarifications and changes.
Intel® E8700 chipset, specifically designed to meet the needs of high-end 2-way and 4-way server platform segments.
Vendor List: support components for E8870 Chipset-based system designs.
Intel® E8870 chipset supports up to four processors, and up to eight processors with the Scalability Port Switch component.
White Paper: assesses potential value and risks of an Itanium®-based server migration.
Case Study: Hotelplan Group moves to the Intel® Itanium® processor 9000 sequence for enhanced performance, reliability, and cloud-ready capabilities.
Brief: The Intel® Itanium® processor 9500 series features new microarchitecture to deliver superior performance, reliability, and power efficiency.