Bem-vindo ao Localizador de conteúdo Intel. Utilize os filtros à esquerda para explorar o conteúdo completo da biblioteca da Intel e para encontrar a informação que procura. Utilize múltiplos filtros para aprimorar seus resultados.
Reference manual for the Dual-Core Intel® Itanium® 2 processor on software development and optimization.
Human Interface Infrastructure Specification describes how the Intel® Platform Innovation Framework for EFI manages user input.
Defines the core code and services required for implementation of the System Management Mode of the Intel® Platform Innovation Framework for EFI.
This document describes the mechanisms by which the Intel® Platform Innovation Framework for EFI (the “Framework”) manages user input.
Validation results for DDR3 RDIMMS on Intel® Itanium® processor 9300-based motherboards.
The Intel® Itanium® processor family provides the foundation for mainframe-class computing systems that offer greater flexibility and better cost models than t...
Intel® Itanium® Architecture definition, application level resources, programming environment, and IA-32 application interface.
Intel® Itanium® Architecture Software Developer's Manual, Vol. 3: Intel® Itanium® Instruction Set.
Manual: Intel® Itanium® Architecture Software Developer's Manual, Vol. 4: IA-32 Instruction Set.
Technical Paper: Next generation Intel® Itanium® processor implemented in 32-nm CMOS has 3.1 billion transistors, and delivers increased performance.
Especificações detalhadas sobre cada membro da família Intel® Itanium®.
Especificações do software do processador Intel® Itanium®
Intel® Itanium® processor provides device and documentation errata, specification clarifications, and changes.
Specification functionality of the System Abstraction Layer for Intel® Itanium® architecture-based systems.
Packaging Databook, Ch. 1: Introduction of package families, including package attributes, package types, and a package selection guide.
Packaging Databook, Ch. 13: Plastic Pin Grid Array Package technology, and its physical structure, electric modeling and performance.
Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.
Packaging Databook, Ch. 16: The Single Edge Contact Cartridge and its physical structure, electrical modeling, and performance.
White Paper: Enhanced reliability, availability, and serviceability (RAS) of Intel® processor-based server platforms simplify business solutions.
White Paper: Intel® Xeon® and Intel® Itanium® processor-based servers scale effective computing capabilities and lower power and cooling costs.
Intel® Itanium® 9000 processor-based servers deliver powerful and scalable performance for UNIX* and mainframe environments.
Discover how to implement server migration from expensive, proprietary platforms to Intel® technology-based solutions for mission-critical needs.
Size workloads for implementation on standards Intel® Itanium® processor, Intel® Xeon® processor HP Integrity* or ProLiant* server platforms.
Intel® processor comparison guide helps select from a range of server platforms based on proven, efficient technology to meet your enterprise needs.
Defines core code for an implementation of the cache data hub subclass of the Intel® Platform Innovation Framework for EFI.