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Babak Sabi
Vice President, Technology and Manufacturing Group
Director, Assembly Test and Technology Development

Babak Sabi Babak Sabi is Vice President of the Technology and Manufacturing Group and director of Assembly Test and Technology Development (ATTD). Since 2009, he has been responsible for the company’s packaging, assembly process, and materials and enabling technology development. Prior to leading ATTD, Sabi led the Corporate Quality Network, starting in 2004.

Previously, Sabi managed technology development quality and reliability, and was responsible for silicon technology certification, assembly, test, and board processes.

Sabi received his Ph.D. in solid state electronics from The Ohio State University in 1984. He has written 10 papers on reliability physics and has received five Intel Achievement Awards. He currently holds two patents.

Presentation Title Moore’s Law and the Impact on Package Scaling

Impact of Moore’ Law scaling on package scaling is discussed in this presentation. Si scaling requires scaling of package feature size to meet both performance and cost expectation. The challenge to meet these requirements and potential research areas are further discussed in this presentation.

Natalie Nielsen
Director, Technology Management

Natalie Nielsen Natalie Nielsen is the Director of Technology Management for Circuits and Systems Research, part of Intel Labs. In this role, she is responsible for developing and driving research strategies to extend Intel’s technology leadership in areas such as silicon photonics, networking, system power, memory, circuits, and trust and security.

Natalie joined Intel in 1996 as a product marketing engineer for Intel’s Embedded IA portfolio. While working in the Embedded IA group, she held a variety of marketing management positions and was instrumental in growing Intel’s presence into markets such as industrial automation, point of sale, kiosks and print imaging. In 2004, Natalie joined Intel Labs and served as the Technical Advisor (TA) to the Director of the Communications Technology Lab (CTL) where she led efforts in low-power IA and mobile platform innovation. She later held the position of Director of CTL Technology Management with a focus on wireless, digital radios, and optical networking.

Natalie holds a BS in Electrical Engineering and a Masters in Business Administration from Brigham Young University.

Presentation Title The Business Side of Research: Bringing Research to Reality

Transitioning new technologies from research to reality is challenging even for World-class research organizations. In fact, some great technologies developed by leading research organizations struggled to bridge the gap and be fully realized in products that made a difference. The inherent nature of business creates barriers which hinder new technology adoption. Business units have schedules to meet, revenue and profits to deliver, limited resources, and a natural aversion to risk. But the barriers can be navigated with a combination of perseverance, knowledge of the technology, and deep knowledge of the customer. Intel Labs has a world-class track record of successfully moving technologies such as virtualization, AMT/VPro and low-power architectures from research to product. Experience teaches that great research is not enough. Teams must make the technology product worthy, listen to the product/business unit partners, and work jointly with these partners to ensure the technology is a success. This presentation will share examples that illustrate BKMs and tools used in Intel to recognize the benefits of emerging technologies and apply them strategically in the business environment.

Rick Howarth
GM – Intel Vietnam

Rick Howarth Rick Howarth is the General Manager of Intel Products Vietnam and is responsible for all aspects of the startup and ramp of Intel’s $1B state of the art assembly and test facility located in HCMC. The new HCMC factory will produce the latest technology microprocessors and chipsets for Intel’s global supply chain and when full the site will employ 4000 employees. Rick and his family have lived in Vietnam for the past 3.5 years.

Prior to coming to Vietnam, Rick was responsible for the chipset operations in Shanghai China where he resided from January 2004 to June 2006. The Shanghai factory was responsible for introducing all new chipsets for Intel’s mobile market segment. Prior to moving to Asia, from 2001-2004, Rick was the co-General Manager for Systems Manufacturing Technology Development. In this role he was responsible for motherboard technology development as well as operational management of Intel’s internal motherboard and systems manufacturing. From 1997-2001, Rick was the Systems manufacturing plant manager responsible for all high volume manufacturing activities for desktop computers, servers and network switches, routers and hubs. Prior to joining Intel he worked for Texas Instruments. Rick has more than 28 years of experience in the high tech industry.

Rick currently serves on the Board of Directors for the American Chamber in HCMC and has also served on the board of directors for Washington State MESA (Math, Engineering, Science Achievement) for three years and holds three US patents.

Presentation Title Welcome Speech

Welcome to the Asia Academic Forum 2010. It is my great pleasure to kick off this year’s forum by welcoming you to HCMC. As most of you know Vietnam is viewed by the world as one of the next great destinations for investment. This sentiment is the result of a stable political climate, a large population, ascension to WTO.

Shekhar Borkar
Intel Fellow

Shekhar Borkar Shekhar Borkar is an Intel Fellow, an IEEE Fellow, and director of Academic Programs and Research in Intel Labs. He holds MSEE from University of Notre Dame and MSc in Physics form University of Bombay. Shekhar’s research interests are low power, high performance digital circuits.



Presentation Title The Exascale Challenge

Compute performance increased by orders of magnitude in the last few decades, made possible by continued technology scaling, improving transistor performance to increase frequency, increasing integration capacity to realize novel architectures, and reducing energy consumed per logic operation to keep power dissipation within limit. The technology treadmill will continue to fulfill the performance demand, and one would expect to reach Exascale level performance in about 10 years. However, it’s the same Physics that helped you in the past will now pose some barriers—“Business as usual” will not be an option.

This talk will discuss potential solutions in all disciplines, such as circuit design, architecture, system design, programming system, and resiliency to pave the road towards Exascale performance.

Thakkar, Ticky
Intel Fellow, Intel Architecture Group Director, UMG Platform Architecture

Thakkar, Ticky Thakkar joined Intel in 1993 as the P6 Multiprocessor architect, serving as the lead architect for the Mobile Internure and engineering management positions at the company in the areas of multiprocessor, CPU, mobile computing and low power architecture. Previously, Thakkar held positions with Sequent Computer Systems, the Oregon Graduate Institute and Metheus Corp. Thakkar holds 64 patents with another 15 patents pending, and has published 29 technical papers.

Presentation Title Squeezing a IA Computer in a Smartphone
Wen-Hann Wang
Vice President, Intel Labs and Director, Circuits and System Research

Wen-Hann Wang Wen-Hann Wang is vice president of Intel Labs and director of Circuits and System Research for Intel Corporation. Prior to his current assignment, he served as vice president of the Software and Services Group (SSG) and general manager of Software and Solutions and Product Development in China. While in SSG, he also held general management positions for the Core Software, the Managed Runtime, and the Middleware Products divisions.

Wang holds 15 patents and has received numerous technical awards, including the inaugural ISCA Influential Paper Award and 1990 SIGMETRICS Award Paper. Prior to joining Intel in 1991, Wang served as a research staff member at IBM T. J. Watson Research Lab.

Wang has worked and studied in three continents. Wang received his bachelor’s degree in electrical engineering from National Taiwan University, a master’s degree in electrical engineering from Philips International Institute of Technological Studies (Netherlands), and a Ph.D. in computer science from the University of Washington.

Presentation Title Powering Future Systems Innovations

The world of computing is expanding beyond the personal computer to an exciting spectrum of computing devices. This presents an interesting opportunity for system researchers. In particular, it calls for revolutionary thinking in system building block research. In this presentation I will discuss research challenges in 5 key subsystem vectors: Security and Trust, Resiliency, Memory Hierarchy, I/O, and Energy Efficiency. I will share some of our research results at Intel Labs and invite you to explore vast opportunities in future systems innovations.