Innovation Strategist
Intel Corporation
Herman D’Hooge is Director of the Intel Futures Lab in CTG and Innovation Strategist with Intel Research responsible in part for “innovating the way Intel innovates”.
Previously, he established a user-centered design & innovation competency chartered with bringing new end-user experiences to personal computing that are informed by real human needs and desires. This human-focused approach involves interdisciplinary teams of ethnographers, user researchers, human factors engineers, industrial designers, interaction designers, technologists and engineers for envisioning and defining future computing experiences, platforms and technologies.
Herman joined Intel in 1981 and has held positions in technology research, development, platform architecture, industry evangelism, and management in areas ranging from multi-processor computer architectures, PC system architecture, operating systems, computer security, fault tolerance, distributed systems, computer-telephony integration, “new users, new uses” applications research, and branded consumer products (smart toys, cameras, audio players).
He received an MS in Electrical Engineering and an MS in Computer Science both from the University of Ghent, Belgium. His professional interests are in understanding how technology can meaningfully impact people’s lives and how user-centered methods can be practically applied to inform technology innovation.
|
Presentation Title
|
People-Centered Technology Innovation: Implications for Engineering Education
|
|
|
|
Abstract:
The traditional “build it and they will come” mindset to technology innovation at Intel increasingly augmented with methods aimed at first trying to understand what people find valuable and have that shape product roadmaps and technology agendas. That also means that it is no longer sufficient for leading technologists, engineers & innovators to “just” be the best in their technical field; additionally they need to acquire a sensibility for the social sciences and creative design and how these “right-brain” disciplines intersect with the traditional engineering disciplines. This presentation provides a high-level overview of the people-centered approach to technology innovation as practiced at Intel and offers several practical suggestions on how academia can better prepare the engineer for this new world.
Senior Principle Engineer
Intel Corporation
Dr. David Grawrock is a Senior Principal Engineer and Security Architect for the Initiatives, Technology Pathfinding and Planning group. His role is the End to End security architect for the Digital Enterprise Group. David continues as the Trusted Execution Technology (formerly LaGrande Technology) lead security architect. Outside of Intel David is the Chair of the Trusted Computing Group TPM workgroup and Intel’s representative to the TCG Technical Committee. David has worked in the computer industry for 28 years holding positions with Central Point Software, Symantec, and Lotus. David is the holder of 20 patents with many more pending. David does have a life outside of Intel; he is a proud father and husband, dedicated soccer coach, fly fisherman, and long suffering family genealogist.
|
Presentation Title
|
The Front Door of Trusted Computing
|
|
|
|
Abstract:
The vPro platform contains security technologies that change the focus of how to control the platform. This talk will describe Trusted Execution Technology (TXT) and how TXT enables control of the software stack. The talk provides the details on TXT and how TXT becomes the front door of trusted computing.
Intel Fellow, Mobility Group
Director, UMG Platform Architecture
Intel Corporation
Shreekant (Ticky) Thakkar is an Intel Fellow, Mobility Group and director, UMG Platform Architecture. In this role, Thakkar serves as the lead architect for the Mobile Internet Device Platform, a computing and communications device representing a strategic growth area for Intel.
Thakkar joined Intel in 1993 as the P6 Multiprocessor architect. He has held several architecture and engineering management positions at the company in the areas of multiprocessor, CPU, mobile computing and low power architecture. Previously, Thakkar held positions with Sequent Computer Systems, the Oregon Graduate Institute and Metheus Corp. Thakkar holds 64 patents with another 15 patents pending, and has published 29 technical papers.
He received his bachelor's degree in statistics and computer science from the University of London in 1977. Thakkar earned masters and doctoral degrees from the University of Manchester in computer science in 1978 and 1982, respectively.
|
Presentation Title
|
Mobile Internet Devices: Enabling The Best Internet Experience in Your Pocket
|
|
|
|
Abstract:
Dr. Thakkar, Intel Fellow and Chief Platform Architect of Intel’s Ultra Mobility Group, shares the technology leaps made in the Intel® Atom™ processor that will bring the next generation of Mobile Internet Devices to consumers.
Designed from the ground up, this new microarchitecture had one guiding principle during development: drastically reduce power consumption without sacrificing performance.
Attend this highly detailed Technology Insight to learn about the revolutionary steps taken to implement and deliver high performance-per-watt efficiency with groundbreaking power management techniques. This is also your chance to get a sneak peek into what is in store for the ultra mobility category over the next few years.
R&D Director at Mobile Platform Group in Shanghai
Intel APAC R&D Center
Dr. Wen Wei was expatriated from Intel Oregon to Intel APAC R&D Center in Shanghai to lead notebook R&D notebook platform solutions development on the next generation Centrino CPU technology since 2004. Dr. Wei joined Intel in 2000 as a hardware engineer and worked at Intel Desktop Platform Group, Intel Communication Group, and Intel Mobile Platform Group. Wen got his PhD on Materials Science and Technologies at Oregon Graduate Institute in 1997. Before he works for Intel, he was a hardware engineer at Credence Systems Corp from 1997-2000. Wen used to work and study at Chinese Academy of Sciences in Beijing before he went to USA.
|
Presentation Title
|
Opportunities to apply advanced technologies on notebook design and manufacture
|
|
|
|
Abstract:
Introduce basic notebook system design and manufacture challenges to make notebook thinner, lighter, cooler, longer battery, more fashionable focusing on new material development such as carbon fiber material, solar cells, advanced cooling, surface finishing, usage model analysis methodologies (e.g., eye ball tracking) and manufacture processing technologies.
