Included on this Page:

Dr. Vittal Kini Dr. Longsong Lin Dr. Wen-Hann Wang Dr. Mazin Yousif Dr. Boon-Lock Yeo

Director, Intel India Research Center
Corporate Technology Group

Dr. Vittal Kini is Director of the Intel India Research Center (IIRC) at Bangalore. The IIRC is the India presence of Intel’s Corporate Technology Group. Dr. Kini leads an organization that researches new platform, systems, and silicon technologies and develops advanced concept computing platforms around Intel’s microprocessors and other silicon products. In his 24-year career with Intel, Dr. Kini has contributed in a wide range of computer systems technology areas. His current and recent work covers platforms ranging from new types of handheld, converged communication devices; to low-power handheld PCs; to interesting evolutions of the familiar notebook PC; and some server and datacenter technologies. A recent key focus of his work has been on system design for high energy efficiency.

Dr. Kini is a B.Tech. (Electronics) alumnus of IIT-Bombay. He received his M.S. and Ph.D. degrees in Electrical Engineering (Computer Engineering) from Carnegie-Mellon University, Pittsburgh, PA. He holds six issued patents and has several others pending. Dr. Kini joined Intel in 1982 and currently resides in Bangalore.

Presentation Title Chip Multiprocessing: Challenges & Issues Presenter Name Vittal Kini Job Title Director, Intel India Research Center

Abstract:
The emphasis on power/performance efficiency is transforming the scaling implied by Moore's law into higher and higher computing density in the form of multiple, multi-threaded processor cores on a chip. The integration of other system components is also imperative to achieve the corresponding scaling of system performance. This could lead to the conversion of computer chips into large Chip Multiprocessing systems/clusters on silicon. Such a move brings an interesting set of challenges in the areas of computer system architecture, power/thermal management, I/O, and system memory. The talk will discuss the feasibility as well as the need for such a move and what, if any, research challenges it poses.

General Manager, Intel Innovation Technologies Ltd.
Director, Intel Innovation Center, Taiwan

Dr. Longsong Lin is General Manager of Intel Innovation Technologies Ltd., and Director of Intel Innovation Center in Taiwan.

Dr. Lin leads the center to drive Intel’s business and technology development and support in communication and networking areas in the Asia Pacific region. In 2003, Intel Innovation Technologies Ltd., an Intel subsidiary, was registered in Taiwan as a legal entity chartered to explore advanced technologies in communications and computing and support APAC regional customers’ technical support activities.

Prior to joining the Intel Communications Group, Intel, Dr. Lin held several senior positions in the industry. He was principal system architect at AMCC, USA, a senior research staff and architect at NEC, Japan, CTO/founder at Opix Networks, USA, and invited scientist at Swiss Federal Institute of Technology (ETHZ), Switzerland.

Dr. Lin had extensive experience in the academia before he worked for the industry. He was an adjunct professor at the National Taiwan University, National Tsing Hua University and National Chiao Tung University, faculty member and Chairman at the National Yunlin University of Sci. and Tech., Taiwan for six years, a visiting professor at the University of Illinois, Urbana Champaign, and a visiting scholar at the Purdue University. He has been a senior member and committee of several standard meetings including IETF, ACM, and IEEE and has served as editors and reviewers for IEEE and several international technical publications.

Dr. Lin served Taiwan government as the principal consultant for the Taiwan Public TV (PTV) Organizing Committee, a principal investigator for the National Science Council (NSC) for several nation-wide projects, a Technical Advisory Board (TAB) member of the 3C Industry Driving Committee, Industrial Technology Research Institute (ITRI), a committee at National Computer and Communication Tech. Development Center, a member of Communication Development Driving Committee, Ministry of Economic Affairs (MOEA), and vice-chairman of Taiwan WiMAX Alliance.

Dr. Lin received his Ph.D. and MSEE degrees in Electrical & Computer Engineering from the Purdue University, USA.

Presentation Title The Dawn of Mobile Broadband Presenter Name Longsong Lin Job Title General Manager, Intel Innovation Technologies Ltd. Director, Intel Innovation Center, Taiwan

Abstract:
While World Wide Webs unwrap the once-hidden technology Ethernet, portals services untie the WWW brilliantly successful – the internetworking is released. While mobile phones librates the fixed lines, WiFi disentangled the mobile-educated people usage with data around you while moving. Internet is reforming itself to feed the users with applications from 1-play to 3-play; yet the access to it is a never ending a demand – the pipe is flying and becoming fat. The world of communication seems becoming unwired and trending from fixed narrow band to broadband mobile. Where is the bus heading for?

Some points of observations from global and Asia viewpoints are manifested in the presentation. Following the argument, what’s the play of WiMAX in the broadband mobile infrastructure and what’s all about its enabling capability for numerous of innovative devices. It is always the unforeseeable mysterious future that motivates us to explore opportunities and adventures.

General Manager
Intel China Product Development

Dr. Wen-Hann Wang was most recently the General Manager of Middleware Products Division of Intel Software and Solution Group (SSG) before taking on the assignment as General Manager of Intel China Product Development. He joined Intel in 1991 as P6 (PentiumPro) Platform Architect where he made significant contributions to the highly successful P6 product family. In addition, Wen-Hann's platform architecture and analysis work was instrumental in the creation of the Xeon server product line. After the well-received P6 product launch in 1995, Wen-Hann served as Platform Infrastructure Research Manager of the newly formed Intel Microprocessor Research Lab (MRL). In late 1998 Wen-Hann became Director of Emerging Platforms Lab, delivering cutting-edge technologies and reference platforms for Intel product groups. Wen-Hann relocated to Shanghai June 2000, for three years, to head up the Technology Development Division of SSG, developing software technologies and reference designs to help accelerating emerging market growth. Prior to joining Intel, Wen-Hann was a Research Staff Member at IBM T. J. Watson Research Center.

Wen-Hann was a first-place winner of the first Intel Microprocessor Innovators Day Contest in 1993 and received the Award of Innovation from a judging committee headed by Dr. Gordon Moore. Wen-Hann was granted 15 patents and received the first Influential Paper Award at 2003 IEEE/ACM International Symposium on Computer Architectures. He also won the Best Paper Award at the ACM SIGMETRICS conference in 1991 for his seminal work on computer architecture simulation methodology.

Wen-Hann is an active participant in professional activities. He was Program Chair of 1999 IEEE Computer Elements Mesa Workshop and Co-General Chair in 2000. He served on the Program Committee of International Symposium on High Performance Computer Architectures in 1998, 2000, 2001 and was a Special Issue Guest Editor for the International Journal on Computer Simulations. Wen-Hann was awarded Certificate of Appreciation from IEEE Computer Society in 1999, 2000, and 2006.

Wen-Hann has worked and studied in three continents. He received his BSEE from the National Taiwan University, MSEE from the Philips International Institute of Technological Studies, in the Netherlands, and Ph.D. in Computer Science from the University of Washington in the United States. He was Adjunct Professor of Peking University 2003-2005, and of Chinese Academy of Sciences 2002-2005.

Presentation Title End to End Platform Infrastructure Technologies for Service Oriented Computing and Applications Presenter Name Wen-Hann Wang Job Title General Manager, Intel China Product Development

Abstract:
Service Oriented Architecture (SOA) has emerged to be the most compelling computing model for future business solutions. It promises drastic increases in IT adaptability and efficiency by maximizing the reuse of standard services. It allows an organization to focus on business-level activities without getting bogged down in the technical details of each and every building block. This talk presents end to end platform infrastructure technologies, including virtualization, manageability, security, networking, content processing and routing, and discuss how they are being used in SOA solutions to lower data center cost, provide faster provisioning, improve management quality and performance, simplify development cycle, and deliver affordable business continuity. The excitement brought forth by the compelling end-to-end platform technologies are being felt by the software industry, driving a paradigm shift and spawning a new software economy. This talk concludes with suggestions for future research opportunities to take SOA to the next plateau.

Principal Engineer,
Corporate Technology Group of Intel

Mazin Yousif is a Principal Engineer in the Corporate Technology Group of Intel Corporation in Hillsboro, OR. He leads a team that focuses on platform provisioning & virtualization to enable platform autonomics in a scale-out environment. Prior to that, Mazin was in the Enterprise Product Group focusing on InfiniBand, datacenter I/O interconnects and datacenter applications workload characterization. Mazin finished his Masters and Ph.D. degrees from the Pennsylvania State University. He served as a Professor in several universities before working for IBM and now Intel.

His research interests include computer architecture, clustered architectures, workload characterization, networking and performance evaluation. He has published 50+ articles in his areas of research. Mazin has chaired several conferences and workshops. He is an IEEE senior member.

Presentation Title Tera-scale Platforms Design Challenges Presenter Name Mazin Yousif Job Title Principal Engineer, Corporate Technology Group of Intel Corporation

Abstract:
Higher performance/power efficiencies are being reflected in the form of many cores in a processor causing interesting set of architectural challenges; both within the chip and the platform. The primary challenge is the type and complexity of cores. However, the plethora of processor architectures (ILP, TLP, in-order, out of order, etc.) complicates the design choice. Along the same lines, the appropriate cache architecture is another design choice. The most interesting challenge is the requirements the cores and caches within the chip put on the architecture of the underlying interconnect. Others include given a certain number of metal and silicon layers, die area size, power budget, technology and cost, what should be the circuit implementation. Yes other challenges including those related to power/thermal and reliability.

At the platform level, the primary challenge is the memory system architecture with sustainable memory bandwidth to feed the many cores. Beside bandwidth sustainability, the memory architecture need to be optimized for shortest access latency through single hop interconnects to minimize cache misses latencies. Network and storage I/O subsystems are critical to develop well-balanced compute-I/O platforms. Network I/O architecture challenges may include, but not limited to, topology, bisection bandwidth, link speeds, isolation, and resource sharing. Storage I/O architecture challenges may include, but not limited to, file system, storage fabrics and storage management. Software challenges covering OS, compiler, applications are even more pronounced. Runtime-execution environment including synchronization, locking, granularity of processes/threads and scheduling are also challenges. Other challenges are mechanical-related covering packaging, thermal and power; providing enough hooks to manage the platform effectively.

This talk will run through a number of the above-mentioned challenges.

General Manager of Intel Asia-Pacific R&D Ltd.;
Co-Director of Intel China Software Center (ICSC).

Boon-Lock Yeo is currently General Manager of Intel Asia-Pacific R&D Ltd. and co-Director of Intel China Software Center (ICSC). He leads large-scale software development efforts and enabling programs in China; projects include software products, tools and open source efforts, including compilers, firmware (Tiano & EFI), Linux and open source projects, software tools for different Intel architecture silicon, and collaborations with universities and local partners. He also oversaw the significant expansion efforts of Intel R&D in China over the past 3 years and led the establishment of Intel R&D site at Shanghai Zizhu campus.

Prior to Intel, he was an entrepreneur and had started a storage startup focusing on building reliable storage solutions based on high volume hardware components. He has also previously held R&D positions focusing on signal / video processing research and productization efforts at IBM T. J. Watson Research Center and AT&T Bell Labs. He received his Ph.D. in Electrical Engineering from Princeton University and BSEE from Purdue University.

He was internationally recognized for his work on image/video processing, data storage and compression. He received an IEEE Transactions Best Paper Award in 1996, has published over 40 technical papers and holds 32 US patents. He was an Associate Editor for IEEE Transactions for Image Processing and had chaired the Storage and Retrieval of Media Databases conference. He co-authored a chapter on open source opportunities in China in the book "Open Sources 2.0" (published by O' Reilly in Oct 2005).

Presentation Title Innovation & Collaboration with Chinese Universities: Multi-Core and beyond Presenter Name Boon-Lock Yeo Job Title General Manager of Intel Asia-Pacific R&D Ltd.; Co-Director of Intel China Software Center (ICSC)

Abstract:
We will present the various initiatives that Intel is driving with PRC universities on emerging technologies and education programs. In particular, we will discuss in details on the various programs in place with the universities to ramp Multi-Core awareness and innovation, and the progress to dates. We will also share efforts underway with the universities on new methods of talent developments, joint research and driving innovations.