Intel and the Ministry of Education (MoE) in China recently organized vocational seminars for the electrical industry. More than 130 duty deans from the electronics and IT departments of more than 50 vocational schools all over China converged in Beijing to take part, marking the first-ever Intel/MOE co-developed Fabrication and Assembly & Test Manufacturing Faculty Training Program.

During the seminar, Kirby Jefferson, General Manager of Intel Fab 68, signed a Memorandum of Understanding (MoU) with the presidents of four vocational schools in Liaoning Province, which was another significant milestone in advancing Intel’s collaboration and innovation in Chinese vocational education.

More than 20 Intel employees contributed 606 volunteer hours to the program, with 10 employees participating in two weeks of face to face training. The training program consisted of eight weeks training on Wafer Fabrication (Fab) and Assembly & Test Manufacturing (ATM). Four courses - Introduction on Microelectronics, Semiconductor Technology, Electronics Packaging, and Surface Mounted Technology (SMT) - were developed with the efforts of trainees and trainers including technical leads from Intel, foreign experts and university professors from Peking University and Guilin University of Electronic Technology.