In August, Intel Products Vietnam and Arizona State University (ASU) held a Microelectronics Packaging curriculum workshop in Ho Chi Minh City. The objective of the workshop was to introduce and accelerate the advancement of the Package Technology curriculum in Vietnam universities through providing an overview of the Package Technology curriculum model from ASU.

30 faculties from five Intel partner universities participated in the workshop, including Ho Chi Minh University of Technology, Ho Chi Minh University of Technical Education, Ho Chi Minh University of Natural Sciences, Ha Noi University of Technology and Da Nang University of Technology. The workshop is part of Intel Vietnam’s Higher Education Program, which includes curriculum development, research, professor and student support.

Microelectronics Packaging was jointly developed by a senior Intel expert team and ASU. The workshop is the first workshop to be held in Vietnam and is the beginning of a long-term collaboration program between Intel and local partner universities in curriculum advancement.