Summary:
The thermal/mechanical solution for the boxed Intel® Pentium® 4 processor in 478-pin package is designed to place a compressive load on the CPU package and socket. It is normal to observe a bow or bend in the motherboard. The level of bow or bend depends on the motherboard material properties and component layout. Heatsinks delivered with boxed Intel® processors are designed for use only with the clip included with this solution. The boxed Pentium 4 processor should be installed after the motherboard has been secured in the chassis. More information can be found in the document entitled, "Assembling Intel Reference Components for the Intel® Pentium® 4 Processor in the 478-Pin Package", which is available at: http://developer.intel.com/design/pentium4/guides/298590.htm.
Details:
The thermal and mechanical retention solution for the boxed Pentium 4 processor in 478-pin package does not require direct attachment to the chassis, unlike the 423-pin package. Instead, the boxed processor thermal/mechanical solution provides for the following:
When the thermal/mechanical solution for the boxed Pentium 4 processor in 478-pin package is installed in the motherboard, it is normal to observe a bow or bend in the motherboard. The level of bow or bend depends on the motherboard material properties and component layout. Testing of the boxed processor thermal/mechanical solution in Intel® Desktop boards has yielded no quality or reliability concerns. For more information on Intel's reference thermal/mechanical design for the Pentium 4 processor in 478-pin package, and the boxed processor thermal/mechanical design, refer to the document entitled, "Assembling Intel Reference Components for the Intel® Pentium® 4 Processor in the 478-Pin Package", which is posted at: http://developer.intel.com/design/pentium4/guides/298590.htm.
The thermal/mechanical solution for the boxed Intel® Pentium® 4 processor in 478-pin package is designed to place a compressive load on the CPU package and socket. It is normal to observe a bow or bend in the motherboard. The level of bow or bend depends on the motherboard material properties and component layout. Heatsinks delivered with boxed Intel® processors are designed for use only with the clip included with this solution. The boxed Pentium 4 processor should be installed after the motherboard has been secured in the chassis. More information can be found in the document entitled, "Assembling Intel Reference Components for the Intel® Pentium® 4 Processor in the 478-Pin Package", which is available at: http://developer.intel.com/design/pentium4/guides/298590.htm.
Details:
The thermal and mechanical retention solution for the boxed Pentium 4 processor in 478-pin package does not require direct attachment to the chassis, unlike the 423-pin package. Instead, the boxed processor thermal/mechanical solution provides for the following:
- Motherboard stiffening to protect socket and chipset solder joints during manufacturing and shipment
- Prevention of package pullout during shipment
- Assurance of thermal interface material performance
When the thermal/mechanical solution for the boxed Pentium 4 processor in 478-pin package is installed in the motherboard, it is normal to observe a bow or bend in the motherboard. The level of bow or bend depends on the motherboard material properties and component layout. Testing of the boxed processor thermal/mechanical solution in Intel® Desktop boards has yielded no quality or reliability concerns. For more information on Intel's reference thermal/mechanical design for the Pentium 4 processor in 478-pin package, and the boxed processor thermal/mechanical design, refer to the document entitled, "Assembling Intel Reference Components for the Intel® Pentium® 4 Processor in the 478-Pin Package", which is posted at: http://developer.intel.com/design/pentium4/guides/298590.htm.